Finite element analysis of thermal-mechanical stress induced failure in interconnects

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OriginalspracheEnglisch
Seiten (von - bis)269-274
Seitenumfang6
FachzeitschriftMaterials Research Society Symposium - Proceedings
Jahrgang539
PublikationsstatusVeröffentlicht - 1999
Veranstaltung1998 MRS Fall Meeting - The Symposium 'Advanced Catalytic Materials-1998' - Boston, MA, USA
Dauer: 30 Nov. 19983 Dez. 1998

Abstract

In this work a study of the nature as well as an evaluation of the thermal-mechanical stress in aluminum interconnects was carried out. A theoretical model describes the atom flux which can be induced by the relaxation of the stress. Based on this theory an algorithm has been developed and integrated into the finite element simulation software. This algorithm allows the calculation of the mass flux divergence and prediction of the failure location before the damage occurs. For the verification of this algorithm an aluminum pad structure sputtered on thermal oxide layer was used. The failure location was correlated with in situ observation during the long term stress tests. Experimental results confirm that the observed structure degradations correspond with the simulations very well.

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Finite element analysis of thermal-mechanical stress induced failure in interconnects. / Yu, X.; Weide, K.
in: Materials Research Society Symposium - Proceedings, Jahrgang 539, 1999, S. 269-274.

Publikation: Beitrag in FachzeitschriftKonferenzaufsatz in FachzeitschriftForschungPeer-Review

Yu, X & Weide, K 1999, 'Finite element analysis of thermal-mechanical stress induced failure in interconnects', Materials Research Society Symposium - Proceedings, Jg. 539, S. 269-274.
Yu, X., & Weide, K. (1999). Finite element analysis of thermal-mechanical stress induced failure in interconnects. Materials Research Society Symposium - Proceedings, 539, 269-274.
Yu X, Weide K. Finite element analysis of thermal-mechanical stress induced failure in interconnects. Materials Research Society Symposium - Proceedings. 1999;539:269-274.
Yu, X. ; Weide, K. / Finite element analysis of thermal-mechanical stress induced failure in interconnects. in: Materials Research Society Symposium - Proceedings. 1999 ; Jahrgang 539. S. 269-274.
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AU - Yu, X.

AU - Weide, K.

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PY - 1999

Y1 - 1999

N2 - In this work a study of the nature as well as an evaluation of the thermal-mechanical stress in aluminum interconnects was carried out. A theoretical model describes the atom flux which can be induced by the relaxation of the stress. Based on this theory an algorithm has been developed and integrated into the finite element simulation software. This algorithm allows the calculation of the mass flux divergence and prediction of the failure location before the damage occurs. For the verification of this algorithm an aluminum pad structure sputtered on thermal oxide layer was used. The failure location was correlated with in situ observation during the long term stress tests. Experimental results confirm that the observed structure degradations correspond with the simulations very well.

AB - In this work a study of the nature as well as an evaluation of the thermal-mechanical stress in aluminum interconnects was carried out. A theoretical model describes the atom flux which can be induced by the relaxation of the stress. Based on this theory an algorithm has been developed and integrated into the finite element simulation software. This algorithm allows the calculation of the mass flux divergence and prediction of the failure location before the damage occurs. For the verification of this algorithm an aluminum pad structure sputtered on thermal oxide layer was used. The failure location was correlated with in situ observation during the long term stress tests. Experimental results confirm that the observed structure degradations correspond with the simulations very well.

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Y2 - 30 November 1998 through 3 December 1998

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