Fabrication Method and Characterization of Molded Interconnect Device Micro Transformer in Planar Form by Embedding Sintered Ferrite Cores

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OriginalspracheEnglisch
Titel des SammelwerksMikroSystemTechnik Kongress 2023
UntertitelMikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Nachhaltigkeit und Technologiesouveranitat, Proceedings
Herausgeber (Verlag)VDE Verlag GmbH
Seiten599-604
Seitenumfang6
ISBN (elektronisch)9783800762040
PublikationsstatusVeröffentlicht - Okt. 2023
VeranstaltungMikroSystemTechnik Kongress 2023: Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Nachhaltigkeit und Technologiesouveranitat MicroSystems - Dresden, Deutschland
Dauer: 23 Okt. 202325 Okt. 2023

Abstract

The rising demand for increasingly powerful hybrid and electric vehicles is driving the development of suitable charging technology. Here, the increase in switching frequency of over 500 kHz in GaN converters leads, among others, to a reduced core cross section for magnetic components. This reduced core cross section enables new fabrication methods for a planar integration. In this paper, a novel fabrication method for planar magnetics with a height of less than 2.5 mm is presented. A two-step injection molding process encapsulates multiple sintered ferrite cores simultaneously with poly-ether ether ketone (PEEK). The coils are produced on PEEK selectively by using a laser system and an electroless plating process. After the transformers are separated, they show an inductivity of up to 4.6 µH, which corresponds to an inductance density of 5.86 µH/cm2, and a coupling coefficient of 91 %. The less complicated winding process and the batch production of the molded interconnect device (MID) transformer allow higher production throughput compared to wire wound transformers.

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Fabrication Method and Characterization of Molded Interconnect Device Micro Transformer in Planar Form by Embedding Sintered Ferrite Cores. / Bierwirth, Tim N.; Fischer, Eike C.; Prediger, Maren S. et al.
MikroSystemTechnik Kongress 2023: Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Nachhaltigkeit und Technologiesouveranitat, Proceedings. VDE Verlag GmbH, 2023. S. 599-604.

Publikation: Beitrag in Buch/Bericht/Sammelwerk/KonferenzbandAufsatz in KonferenzbandForschung

Bierwirth, TN, Fischer, EC, Prediger, MS, Le, TM, Dencker, F & Wurz, MC 2023, Fabrication Method and Characterization of Molded Interconnect Device Micro Transformer in Planar Form by Embedding Sintered Ferrite Cores. in MikroSystemTechnik Kongress 2023: Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Nachhaltigkeit und Technologiesouveranitat, Proceedings. VDE Verlag GmbH, S. 599-604, MikroSystemTechnik Kongress 2023, Dresden, Deutschland, 23 Okt. 2023.
Bierwirth, T. N., Fischer, E. C., Prediger, M. S., Le, T. M., Dencker, F., & Wurz, M. C. (2023). Fabrication Method and Characterization of Molded Interconnect Device Micro Transformer in Planar Form by Embedding Sintered Ferrite Cores. In MikroSystemTechnik Kongress 2023: Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Nachhaltigkeit und Technologiesouveranitat, Proceedings (S. 599-604). VDE Verlag GmbH.
Bierwirth TN, Fischer EC, Prediger MS, Le TM, Dencker F, Wurz MC. Fabrication Method and Characterization of Molded Interconnect Device Micro Transformer in Planar Form by Embedding Sintered Ferrite Cores. in MikroSystemTechnik Kongress 2023: Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Nachhaltigkeit und Technologiesouveranitat, Proceedings. VDE Verlag GmbH. 2023. S. 599-604
Bierwirth, Tim N. ; Fischer, Eike C. ; Prediger, Maren S. et al. / Fabrication Method and Characterization of Molded Interconnect Device Micro Transformer in Planar Form by Embedding Sintered Ferrite Cores. MikroSystemTechnik Kongress 2023: Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Nachhaltigkeit und Technologiesouveranitat, Proceedings. VDE Verlag GmbH, 2023. S. 599-604
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abstract = "The rising demand for increasingly powerful hybrid and electric vehicles is driving the development of suitable charging technology. Here, the increase in switching frequency of over 500 kHz in GaN converters leads, among others, to a reduced core cross section for magnetic components. This reduced core cross section enables new fabrication methods for a planar integration. In this paper, a novel fabrication method for planar magnetics with a height of less than 2.5 mm is presented. A two-step injection molding process encapsulates multiple sintered ferrite cores simultaneously with poly-ether ether ketone (PEEK). The coils are produced on PEEK selectively by using a laser system and an electroless plating process. After the transformers are separated, they show an inductivity of up to 4.6 µH, which corresponds to an inductance density of 5.86 µH/cm2, and a coupling coefficient of 91 %. The less complicated winding process and the batch production of the molded interconnect device (MID) transformer allow higher production throughput compared to wire wound transformers.",
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AU - Fischer, Eike C.

AU - Prediger, Maren S.

AU - Le, Trong M.

AU - Dencker, Folke

AU - Wurz, Marc C.

N1 - Publisher Copyright: © VDE VERLAG GMBH ∙ Berlin ∙ Offenbach.

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N2 - The rising demand for increasingly powerful hybrid and electric vehicles is driving the development of suitable charging technology. Here, the increase in switching frequency of over 500 kHz in GaN converters leads, among others, to a reduced core cross section for magnetic components. This reduced core cross section enables new fabrication methods for a planar integration. In this paper, a novel fabrication method for planar magnetics with a height of less than 2.5 mm is presented. A two-step injection molding process encapsulates multiple sintered ferrite cores simultaneously with poly-ether ether ketone (PEEK). The coils are produced on PEEK selectively by using a laser system and an electroless plating process. After the transformers are separated, they show an inductivity of up to 4.6 µH, which corresponds to an inductance density of 5.86 µH/cm2, and a coupling coefficient of 91 %. The less complicated winding process and the batch production of the molded interconnect device (MID) transformer allow higher production throughput compared to wire wound transformers.

AB - The rising demand for increasingly powerful hybrid and electric vehicles is driving the development of suitable charging technology. Here, the increase in switching frequency of over 500 kHz in GaN converters leads, among others, to a reduced core cross section for magnetic components. This reduced core cross section enables new fabrication methods for a planar integration. In this paper, a novel fabrication method for planar magnetics with a height of less than 2.5 mm is presented. A two-step injection molding process encapsulates multiple sintered ferrite cores simultaneously with poly-ether ether ketone (PEEK). The coils are produced on PEEK selectively by using a laser system and an electroless plating process. After the transformers are separated, they show an inductivity of up to 4.6 µH, which corresponds to an inductance density of 5.86 µH/cm2, and a coupling coefficient of 91 %. The less complicated winding process and the batch production of the molded interconnect device (MID) transformer allow higher production throughput compared to wire wound transformers.

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Y2 - 23 October 2023 through 25 October 2023

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