TY - JOUR

T1 - Fabrication and use of Cu-Cr-diamond composites for the application in deep feed grinding of tungsten carbide

AU - Denkena, B.

AU - Krödel, A.

AU - Lang, R.

N1 - Funding Information: The authors would like to thank the German Research Foundation (DFG) for their organizational and financial support within the project DE447/184-1 .

PY - 2021/12

Y1 - 2021/12

N2 - Machining of tungsten carbide requires the use of highly wear resistant grinding tools, like metal bonded grinding tools. The abrasive layer of these grinding tools can be regarded as Metal-Matrix-Composites reinforced with diamond particles. Copper-Matrix-Composites already are being used as heat sink materials through their outstanding high thermal conductivity. In this work, Cu/Diamond composites with 50 vol% diamond have been fabricated through field assisted sintering and the application of these composites as grinding layers in a deep feed grinding process of tungsten carbide was investigated. Through addition of chromium powder as a carbide former on the surface of the diamond particles, the critical bond strength and therefore the diamond grain retention was significantly increased by +363%. The addition of 2 wt% chromium to the copper matrix also resulted in a +84% increase of thermal conductivity relatively to the chromium free Cu/Diamond composite. Grinding of tungsten carbide as a dynamic stress test showed that the increased grain retention and thermal conductivity resulted in a decrease in grinding layer wear. Further chromium addition to 8 wt% chromium resulted in a decrease in thermal conductivity and the formation of adhesive cloggings on the grinding wheel surface during grinding.

AB - Machining of tungsten carbide requires the use of highly wear resistant grinding tools, like metal bonded grinding tools. The abrasive layer of these grinding tools can be regarded as Metal-Matrix-Composites reinforced with diamond particles. Copper-Matrix-Composites already are being used as heat sink materials through their outstanding high thermal conductivity. In this work, Cu/Diamond composites with 50 vol% diamond have been fabricated through field assisted sintering and the application of these composites as grinding layers in a deep feed grinding process of tungsten carbide was investigated. Through addition of chromium powder as a carbide former on the surface of the diamond particles, the critical bond strength and therefore the diamond grain retention was significantly increased by +363%. The addition of 2 wt% chromium to the copper matrix also resulted in a +84% increase of thermal conductivity relatively to the chromium free Cu/Diamond composite. Grinding of tungsten carbide as a dynamic stress test showed that the increased grain retention and thermal conductivity resulted in a decrease in grinding layer wear. Further chromium addition to 8 wt% chromium resulted in a decrease in thermal conductivity and the formation of adhesive cloggings on the grinding wheel surface during grinding.

KW - Abrasion

KW - Carbides

KW - Composites

KW - Cutting tools

KW - High pressure high temperature (HTHP)

KW - Interface characterization

KW - Mechanical properties characterization

KW - Synthetic diamond

KW - Thermal properties

KW - Wear

UR - http://www.scopus.com/inward/record.url?scp=85117683341&partnerID=8YFLogxK

U2 - 10.1016/j.diamond.2021.108668

DO - 10.1016/j.diamond.2021.108668

M3 - Article

AN - SCOPUS:85117683341

VL - 120

JO - Diamond and Related Materials

JF - Diamond and Related Materials

SN - 0925-9635

M1 - 108668

ER -