Details
| Originalsprache | Englisch |
|---|---|
| Seiten (von - bis) | 42-47 |
| Seitenumfang | 6 |
| Fachzeitschrift | Sensors and Actuators, A: Physical |
| Jahrgang | 267 |
| Frühes Online-Datum | 28 Sept. 2017 |
| Publikationsstatus | Veröffentlicht - 1 Nov. 2017 |
Abstract
This paper presents the fabrication and characterization of a microtransformer device for high-frequency power applications using electroplating and photolithography techniques. These devices are realized on an oxidized silicon wafer. They have the identical geometry on the primary and the secondary side combined with a core thickness value of 6 μm. The device consists of six coils (three coils on the primary side and three coils on the secondary side) and each coil has nine numbers of turns. The copper coil winding and the Ni-Fe-W alloy magnetic core are fabricated by electroplating. The fabricated microtransformer has an inductance ranging from 25 nH to 74 nH. An optimum quality factor of 4.5 is obtained at 70 MHz.
ASJC Scopus Sachgebiete
- Werkstoffwissenschaften (insg.)
- Elektronische, optische und magnetische Materialien
- Physik und Astronomie (insg.)
- Instrumentierung
- Physik und Astronomie (insg.)
- Physik der kondensierten Materie
- Werkstoffwissenschaften (insg.)
- Oberflächen, Beschichtungen und Folien
- Werkstoffwissenschaften (insg.)
- Metalle und Legierungen
- Ingenieurwesen (insg.)
- Elektrotechnik und Elektronik
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in: Sensors and Actuators, A: Physical, Jahrgang 267, 01.11.2017, S. 42-47.
Publikation: Beitrag in Fachzeitschrift › Artikel › Forschung › Peer-Review
}
TY - JOUR
T1 - Fabrication and characterization of a Ni-Fe-W core microtransformer for high-Frequency power applications
AU - Mundotiya, Brij Mohan
AU - Dinulovic, Dragan
AU - Rissing, Lutz
AU - Wurz, Marc Christopher
N1 - Publisher Copyright: © 2017 Copyright: Copyright 2017 Elsevier B.V., All rights reserved.
PY - 2017/11/1
Y1 - 2017/11/1
N2 - This paper presents the fabrication and characterization of a microtransformer device for high-frequency power applications using electroplating and photolithography techniques. These devices are realized on an oxidized silicon wafer. They have the identical geometry on the primary and the secondary side combined with a core thickness value of 6 μm. The device consists of six coils (three coils on the primary side and three coils on the secondary side) and each coil has nine numbers of turns. The copper coil winding and the Ni-Fe-W alloy magnetic core are fabricated by electroplating. The fabricated microtransformer has an inductance ranging from 25 nH to 74 nH. An optimum quality factor of 4.5 is obtained at 70 MHz.
AB - This paper presents the fabrication and characterization of a microtransformer device for high-frequency power applications using electroplating and photolithography techniques. These devices are realized on an oxidized silicon wafer. They have the identical geometry on the primary and the secondary side combined with a core thickness value of 6 μm. The device consists of six coils (three coils on the primary side and three coils on the secondary side) and each coil has nine numbers of turns. The copper coil winding and the Ni-Fe-W alloy magnetic core are fabricated by electroplating. The fabricated microtransformer has an inductance ranging from 25 nH to 74 nH. An optimum quality factor of 4.5 is obtained at 70 MHz.
KW - Electroplating
KW - Inductance
KW - Microtransformer
KW - Photolithography
KW - Quality factor
UR - http://www.scopus.com/inward/record.url?scp=85030785180&partnerID=8YFLogxK
U2 - 10.1016/j.sna.2017.09.032
DO - 10.1016/j.sna.2017.09.032
M3 - Article
AN - SCOPUS:85030785180
VL - 267
SP - 42
EP - 47
JO - Sensors and Actuators, A: Physical
JF - Sensors and Actuators, A: Physical
SN - 0924-4247
ER -