Experimental study of the ground plane in asymmetric coupled silicon lines

Publikation: Konferenzbeitrag › Paper › Forschung › Peer-Review

Autoren

  • Uwe Arz
  • Dylan F. Williams
  • Hartmut Grabinski

Organisationseinheiten

Externe Organisationen

  • National Institute of Standards and Technology (NIST)
Forschungs-netzwerk anzeigen

Details

OriginalspracheEnglisch
Seiten317-320
Seitenumfang4
PublikationsstatusVeröffentlicht - 2001
VeranstaltungIEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging - Cambridge, USA / Vereinigte Staaten
Dauer: 29 Okt. 2001 → 31 Okt. 2001

Konferenz

KonferenzIEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging
Land/GebietUSA / Vereinigte Staaten
OrtCambridge
Zeitraum29 Okt. 2001 → 31 Okt. 2001

Abstract

We use a measurement method designed for coupled lines on highly conductive substrates to characterize identical asymmetric coupled lines fabricated on lossy silicon with and without a metallization plane beneath the two signal conductors. The study illustrates the important role of the return path in determining the electromagnetic coupling between the lines.

ASJC Scopus Sachgebiete

Zitieren

Experimental study of the ground plane in asymmetric coupled silicon lines. / Arz, Uwe; Williams, Dylan F.; Grabinski, Hartmut.
2001. 317-320 Beitrag in IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging, Cambridge, Massachusetts, USA / Vereinigte Staaten.

Publikation: Konferenzbeitrag › Paper › Forschung › Peer-Review

Arz, U, Williams, DF & Grabinski, H 2001, 'Experimental study of the ground plane in asymmetric coupled silicon lines', Beitrag in IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging, Cambridge, USA / Vereinigte Staaten, 29 Okt. 2001 - 31 Okt. 2001 S. 317-320. https://doi.org/10.1109/EPEP.2001.967672
Arz, U., Williams, D. F., & Grabinski, H. (2001). Experimental study of the ground plane in asymmetric coupled silicon lines. 317-320. Beitrag in IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging, Cambridge, Massachusetts, USA / Vereinigte Staaten. https://doi.org/10.1109/EPEP.2001.967672
Arz U, Williams DF, Grabinski H. Experimental study of the ground plane in asymmetric coupled silicon lines. 2001. Beitrag in IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging, Cambridge, Massachusetts, USA / Vereinigte Staaten. doi: 10.1109/EPEP.2001.967672
Arz, Uwe ; Williams, Dylan F. ; Grabinski, Hartmut. / Experimental study of the ground plane in asymmetric coupled silicon lines. Beitrag in IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging, Cambridge, Massachusetts, USA / Vereinigte Staaten.4 S.
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