Experimental and simulative investigation of a multistage 2K injection molding process of PA6 and EPDM

Publikation: Beitrag in FachzeitschriftArtikelForschungPeer-Review

Autoren

  • Sebastian Teich
  • Edmund Haberstroh
  • Ulrich Giese

Externe Organisationen

  • Deutsches Institut für Kautschuktechnologie e.V. (DIK)
Forschungs-netzwerk anzeigen

Details

OriginalspracheEnglisch
Aufsatznummer51520
FachzeitschriftJournal of applied polymer science
Jahrgang139
Ausgabenummer3
PublikationsstatusVeröffentlicht - 4 Okt. 2021
Extern publiziertJa

Abstract

For investigations on a two-stage multicomponent injection molding process adhesion-modified polyamide 6 and EPDM with sulfur-curing system are used. The influence of different process temperatures is investigated on the basis of a DoE test plan with 15 factor level combinations. Within the scope of additional, more in-depth investigations, special focus was given to the preheating temperature of the thermoplastic insert. In addition to the experimental work, results from simulations are used to assess the influencing factors. This approach allows a more precise description of the influence of temperature equilibration processes on the crosslinking reaction, especially near the interface between the two components. It is shown that the preheating temperature of the hard component (thermoplastic) in particular has a significant influence on the time course of the crosslinking reaction and ultimately on adhesion to the thermoplastic substrate.

ASJC Scopus Sachgebiete

Zitieren

Experimental and simulative investigation of a multistage 2K injection molding process of PA6 and EPDM. / Teich, Sebastian; Haberstroh, Edmund; Giese, Ulrich.
in: Journal of applied polymer science, Jahrgang 139, Nr. 3, 51520, 04.10.2021.

Publikation: Beitrag in FachzeitschriftArtikelForschungPeer-Review

Teich, Sebastian ; Haberstroh, Edmund ; Giese, Ulrich. / Experimental and simulative investigation of a multistage 2K injection molding process of PA6 and EPDM. in: Journal of applied polymer science. 2021 ; Jahrgang 139, Nr. 3.
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