Details
| Originalsprache | Englisch |
|---|---|
| Titel des Sammelwerks | Processing Materials of 3D Interconnects, Damascene and Electronics Packaging 8 |
| Herausgeber (Verlag) | Electrochemical Society, Inc. |
| Seiten | 25-32 |
| Seitenumfang | 8 |
| Band | 75 |
| Auflage | 7 |
| ISBN (elektronisch) | 9781607685395 |
| Publikationsstatus | Veröffentlicht - 2016 |
| Veranstaltung | Symposium on Processing Materials of 3D Interconnects, Damascene and Electronics Packaging 8 - PRiME 2016/230th ECS Meeting - Honolulu, USA / Vereinigte Staaten Dauer: 2 Okt. 2016 → 7 Okt. 2016 |
Publikationsreihe
| Name | PROCESSING MATERIALS OF 3D INTERCONNECTS, DAMASCENE AND ELECTRONICS PACKAGING 8 |
|---|---|
| ISSN (Print) | 1938-5862 |
Abstract
Electroplating is a common process in micro technologies and in large scale application to create e.g. corrosion protected surfaces (1). New technologies as three dimensional printing and vacuum casting enable new methods to create surfaces. This provides the opportunity to merge micro structures [e.g. conductors] with macro structures [e.g. curvature]. The created textures might be implemented in an electroplating based pattern transfer process. The results indicate the possibility of creating functional planar and three dimensional structures using the described technology.
ASJC Scopus Sachgebiete
- Ingenieurwesen (insg.)
- Allgemeiner Maschinenbau
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Processing Materials of 3D Interconnects, Damascene and Electronics Packaging 8. Band 75 7. Aufl. Electrochemical Society, Inc., 2016. S. 25-32 (PROCESSING MATERIALS OF 3D INTERCONNECTS, DAMASCENE AND ELECTRONICS PACKAGING 8).
Publikation: Beitrag in Buch/Bericht/Sammelwerk/Konferenzband › Aufsatz in Konferenzband › Forschung › Peer-Review
}
TY - GEN
T1 - Electroplating through fluidic channels as production technology for 3d interconnect devices and sensing structures
AU - Rechel, Mathias
AU - Bengsch, Sebastian
AU - Wurz, Marc Christopher
N1 - Copyright: Copyright 2017 Elsevier B.V., All rights reserved.
PY - 2016
Y1 - 2016
N2 - Electroplating is a common process in micro technologies and in large scale application to create e.g. corrosion protected surfaces (1). New technologies as three dimensional printing and vacuum casting enable new methods to create surfaces. This provides the opportunity to merge micro structures [e.g. conductors] with macro structures [e.g. curvature]. The created textures might be implemented in an electroplating based pattern transfer process. The results indicate the possibility of creating functional planar and three dimensional structures using the described technology.
AB - Electroplating is a common process in micro technologies and in large scale application to create e.g. corrosion protected surfaces (1). New technologies as three dimensional printing and vacuum casting enable new methods to create surfaces. This provides the opportunity to merge micro structures [e.g. conductors] with macro structures [e.g. curvature]. The created textures might be implemented in an electroplating based pattern transfer process. The results indicate the possibility of creating functional planar and three dimensional structures using the described technology.
UR - http://www.scopus.com/inward/record.url?scp=84991501176&partnerID=8YFLogxK
U2 - 10.1149/07507.0025ecst
DO - 10.1149/07507.0025ecst
M3 - Conference contribution
AN - SCOPUS:84991501176
VL - 75
T3 - PROCESSING MATERIALS OF 3D INTERCONNECTS, DAMASCENE AND ELECTRONICS PACKAGING 8
SP - 25
EP - 32
BT - Processing Materials of 3D Interconnects, Damascene and Electronics Packaging 8
PB - Electrochemical Society, Inc.
T2 - Symposium on Processing Materials of 3D Interconnects, Damascene and Electronics Packaging 8 - PRiME 2016/230th ECS Meeting
Y2 - 2 October 2016 through 7 October 2016
ER -