Details
| Originalsprache | Englisch |
|---|---|
| Seiten (von - bis) | 1575-1580 |
| Seitenumfang | 6 |
| Fachzeitschrift | Microelectronics reliability |
| Jahrgang | 53 |
| Ausgabenummer | 9-11 |
| Publikationsstatus | Veröffentlicht - Sept. 2013 |
Abstract
The progress in three dimensional packaging leads to smaller solder joints. A growing part of their volume consists of IMCs (intermetallic compounds). The IMCs are formed through migration processes during the soldering. These phenomena continue during use of the component. As a consequence micro bumps (ø < 30 μm) completely consist of intermetallic compounds. Intermetallic compounds also enable electromigration induced void formation at the contacts surfaces of flip chip solder joints. It is essential for the fabrication of micro bumps and for the investigation of failure mechanisms in flip chip solder joints to characterize the migration-induced IMC formation. This study is based on the combination of electromigration, thermomigration and temperature storage tests on SnAg3.0Cu0.5 solder joints with NiAu pads. For the investigation of migration processes due to temperature gradients (thermomigration), alternating current tests for solder joints were developed. Finally, more accurate material parameters for the description of the migration-induced intermetallic compound formation are extracted, namely the activation energy (EA), the diffusion constant (D0), the effective charge of the moving ions (Z*) and the heat of transport (Q*).
ASJC Scopus Sachgebiete
- Werkstoffwissenschaften (insg.)
- Elektronische, optische und magnetische Materialien
- Physik und Astronomie (insg.)
- Atom- und Molekularphysik sowie Optik
- Ingenieurwesen (insg.)
- Sicherheit, Risiko, Zuverlässigkeit und Qualität
- Physik und Astronomie (insg.)
- Physik der kondensierten Materie
- Werkstoffwissenschaften (insg.)
- Oberflächen, Beschichtungen und Folien
- Ingenieurwesen (insg.)
- Elektrotechnik und Elektronik
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in: Microelectronics reliability, Jahrgang 53, Nr. 9-11, 09.2013, S. 1575-1580.
Publikation: Beitrag in Fachzeitschrift › Artikel › Forschung › Peer-Review
}
TY - JOUR
T1 - Electro- and thermomigration-induced IMC formation in SnAg 3.0Cu0.5 solder joints on nickel gold pads
AU - Meinshausen, L.
AU - Frémont, H.
AU - Weide-Zaage, K.
AU - Plano, B.
N1 - Funding Information: This work was supported by PROCOPE-PKZ-D/0811472, founded by the DAAD and the French Ministry for Foreign Affairs. Copyright: Copyright 2013 Elsevier B.V., All rights reserved.
PY - 2013/9
Y1 - 2013/9
N2 - The progress in three dimensional packaging leads to smaller solder joints. A growing part of their volume consists of IMCs (intermetallic compounds). The IMCs are formed through migration processes during the soldering. These phenomena continue during use of the component. As a consequence micro bumps (ø < 30 μm) completely consist of intermetallic compounds. Intermetallic compounds also enable electromigration induced void formation at the contacts surfaces of flip chip solder joints. It is essential for the fabrication of micro bumps and for the investigation of failure mechanisms in flip chip solder joints to characterize the migration-induced IMC formation. This study is based on the combination of electromigration, thermomigration and temperature storage tests on SnAg3.0Cu0.5 solder joints with NiAu pads. For the investigation of migration processes due to temperature gradients (thermomigration), alternating current tests for solder joints were developed. Finally, more accurate material parameters for the description of the migration-induced intermetallic compound formation are extracted, namely the activation energy (EA), the diffusion constant (D0), the effective charge of the moving ions (Z*) and the heat of transport (Q*).
AB - The progress in three dimensional packaging leads to smaller solder joints. A growing part of their volume consists of IMCs (intermetallic compounds). The IMCs are formed through migration processes during the soldering. These phenomena continue during use of the component. As a consequence micro bumps (ø < 30 μm) completely consist of intermetallic compounds. Intermetallic compounds also enable electromigration induced void formation at the contacts surfaces of flip chip solder joints. It is essential for the fabrication of micro bumps and for the investigation of failure mechanisms in flip chip solder joints to characterize the migration-induced IMC formation. This study is based on the combination of electromigration, thermomigration and temperature storage tests on SnAg3.0Cu0.5 solder joints with NiAu pads. For the investigation of migration processes due to temperature gradients (thermomigration), alternating current tests for solder joints were developed. Finally, more accurate material parameters for the description of the migration-induced intermetallic compound formation are extracted, namely the activation energy (EA), the diffusion constant (D0), the effective charge of the moving ions (Z*) and the heat of transport (Q*).
UR - http://www.scopus.com/inward/record.url?scp=84886911358&partnerID=8YFLogxK
U2 - 10.1016/j.microrel.2013.07.038
DO - 10.1016/j.microrel.2013.07.038
M3 - Article
AN - SCOPUS:84886911358
VL - 53
SP - 1575
EP - 1580
JO - Microelectronics reliability
JF - Microelectronics reliability
SN - 0026-2714
IS - 9-11
ER -