TY - JOUR

T1 - Electrical resistance-based fatigue assessment and capability prediction of extrudates from recycled field-assisted sintered EN AW-6082 aluminium chips

AU - Koch, Alexander

AU - Bonhage, Martin

AU - Teschke, Mirko

AU - Luecker, Lukas

AU - Behrens, Bernd Arno

AU - Walther, Frank

N1 - Funding Information: The development of defect volume determination by electrical resistance measurements and experimental setup is funded by the German Research Foundation (Deutsche Forschungsgemeinschaft, DFG) within the Collaborative Research Center CRC /Transregio 188 “Damage-Controlled Forming Processes” (subproject B01, project number 278868966 ).

PY - 2020/11

Y1 - 2020/11

N2 - The possibility to directly extrude semi-finished products using a solid-state-recycling process is a promising alternative to the remelting process, which is highly energy-intensive. Therefore, aluminium chips, normally considered as scrap, are used as the basis for the recycling. The recycling process consists of a cold compaction process, a field-assisted sintering (FAST) process to consolidate the chips, and finally a forward rod extrusion process. Compared to approaches which break the oxide layers by applying high shear stresses and deformations, necessary for an adequate welding of the chips, quasistatic and cyclic properties and capabilities are significantly increased. The defect structure of specimens, which was determined by means of computed tomography and which significantly influences the lifetime, could be correlated well with pre-test electrical resistance measurements. Finally, these findings were used to establish a lifetime calculation model based on unique electrical resistance measurements prior to mechanical testing.

AB - The possibility to directly extrude semi-finished products using a solid-state-recycling process is a promising alternative to the remelting process, which is highly energy-intensive. Therefore, aluminium chips, normally considered as scrap, are used as the basis for the recycling. The recycling process consists of a cold compaction process, a field-assisted sintering (FAST) process to consolidate the chips, and finally a forward rod extrusion process. Compared to approaches which break the oxide layers by applying high shear stresses and deformations, necessary for an adequate welding of the chips, quasistatic and cyclic properties and capabilities are significantly increased. The defect structure of specimens, which was determined by means of computed tomography and which significantly influences the lifetime, could be correlated well with pre-test electrical resistance measurements. Finally, these findings were used to establish a lifetime calculation model based on unique electrical resistance measurements prior to mechanical testing.

KW - Computed tomography

KW - Fatigue behaviour

KW - Lifetime prediction

KW - Resistance measurements

KW - Solid-state-recycling

UR - http://www.scopus.com/inward/record.url?scp=85091938847&partnerID=8YFLogxK

U2 - 10.1016/j.matchar.2020.110644

DO - 10.1016/j.matchar.2020.110644

M3 - Article

AN - SCOPUS:85091938847

VL - 169

JO - Materials Characterization

JF - Materials Characterization

SN - 1044-5803

M1 - 110644

ER -