Details
| Originalsprache | Englisch |
|---|---|
| Titel des Sammelwerks | 2004 IEEE International Reliability Physics Symposium. Proceedings |
| Seiten | 619-620 |
| Seitenumfang | 2 |
| Publikationsstatus | Veröffentlicht - 2004 |
| Veranstaltung | 2004 IEEE International Reliability Physics Symposium, 42nd Annual - Phoenix, AZ., USA / Vereinigte Staaten Dauer: 25 Apr. 2004 → 29 Apr. 2004 |
Publikationsreihe
| Name | Annual Proceedings - Reliability Physics (Symposium) |
|---|---|
| ISSN (Print) | 0099-9512 |
Abstract
The combined effects of electromigration and thermomigration are studied. Significantly shorter electromigration lifetimes are observed in the presence of a temperature gradient. This cannot be explained by thermomigration only, but is attributed to the effect of temperature gradient on electromigration-induced failures.
ASJC Scopus Sachgebiete
- Ingenieurwesen (insg.)
- Elektrotechnik und Elektronik
- Ingenieurwesen (insg.)
- Sicherheit, Risiko, Zuverlässigkeit und Qualität
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2004 IEEE International Reliability Physics Symposium. Proceedings. 2004. S. 619-620 (Annual Proceedings - Reliability Physics (Symposium)).
Publikation: Beitrag in Buch/Bericht/Sammelwerk/Konferenzband › Aufsatz in Konferenzband › Forschung › Peer-Review
}
TY - GEN
T1 - Effect of thermal gradients on the electromigration lifetime in power electronics
AU - Nguyen, H. V.
AU - Salm, C.
AU - Krabbenborg, B.
AU - Weide-Zaage, K.
AU - Bisschop, J.
AU - Mouthaan, A. J.
AU - Kuper, F. G.
N1 - Copyright: Copyright 2008 Elsevier B.V., All rights reserved.
PY - 2004
Y1 - 2004
N2 - The combined effects of electromigration and thermomigration are studied. Significantly shorter electromigration lifetimes are observed in the presence of a temperature gradient. This cannot be explained by thermomigration only, but is attributed to the effect of temperature gradient on electromigration-induced failures.
AB - The combined effects of electromigration and thermomigration are studied. Significantly shorter electromigration lifetimes are observed in the presence of a temperature gradient. This cannot be explained by thermomigration only, but is attributed to the effect of temperature gradient on electromigration-induced failures.
KW - Electromigration
KW - Fast thermal stressing
KW - Power electronics
KW - Thermomigration
UR - http://www.scopus.com/inward/record.url?scp=3042522547&partnerID=8YFLogxK
M3 - Conference contribution
AN - SCOPUS:3042522547
SN - 0-7803-8315-X
T3 - Annual Proceedings - Reliability Physics (Symposium)
SP - 619
EP - 620
BT - 2004 IEEE International Reliability Physics Symposium. Proceedings
T2 - 2004 IEEE International Reliability Physics Symposium, 42nd Annual
Y2 - 25 April 2004 through 29 April 2004
ER -