Details
| Originalsprache | Englisch |
|---|---|
| Seiten (von - bis) | 1882-1885 |
| Seitenumfang | 4 |
| Fachzeitschrift | Microelectronics reliability |
| Jahrgang | 55 |
| Ausgabenummer | 9-10 |
| Publikationsstatus | Veröffentlicht - Aug. 2015 |
Abstract
The ternary Sn-1.0Ag-0.5Cu (SAC105) solders doped with a minor addition of Fe (0.1, 0.3 and 0.5 wt.%) have been shown to demonstrate excellent mechanical thermal cyclic reliability. To complement the mechanical performance, the electrical resistivities of SAC105, SAC105-0.1Fe, SAC105-0.3Fe, and SAC105-0.5Fe bulk solder alloys were also characterised after thermal aging. Results showed that the overall resistivity decreased by up to 13% after the thermal aging process. Meanwhile the electrical resistivity for 0.1 wt.%, 0.3 wt.%, and 0.5 wt.% Fe-bearing SAC105 solder alloys decreased by 25%, 11%, and 17% respectively, showing a rather stable reduction in resistivity. This can be correlated to the stabilisation of the microstructure of the Fe-added SAC 105 after thermal aging.
ASJC Scopus Sachgebiete
- Werkstoffwissenschaften (insg.)
- Elektronische, optische und magnetische Materialien
- Physik und Astronomie (insg.)
- Atom- und Molekularphysik sowie Optik
- Ingenieurwesen (insg.)
- Sicherheit, Risiko, Zuverlässigkeit und Qualität
- Physik und Astronomie (insg.)
- Physik der kondensierten Materie
- Werkstoffwissenschaften (insg.)
- Oberflächen, Beschichtungen und Folien
- Ingenieurwesen (insg.)
- Elektrotechnik und Elektronik
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in: Microelectronics reliability, Jahrgang 55, Nr. 9-10, 08.2015, S. 1882-1885.
Publikation: Beitrag in Fachzeitschrift › Artikel › Forschung › Peer-Review
}
TY - JOUR
T1 - Effect of thermal aging on the electrical resistivity of Fe-added SAC105 solder alloys
AU - Sabri, M. F.M.
AU - Nordin, N. I.M.
AU - Said, S. M.
AU - Amin, N. A.A.M.
AU - Arof, H.
AU - Jauhari, I.
AU - Ramli, R.
AU - Weide-Zaage, K.
N1 - Funding Information: The authors acknowledge the financial support provided by UMRG Fund ( RP003A-13AET , RP003B-13AET and RP003C-13AET ) and High Impact Research (Grant No. UM.C/25/1/HIR/MOHE/ENG/29 ). Publisher Copyright: © 2015 Elsevier Ltd. Copyright: Copyright 2015 Elsevier B.V., All rights reserved.
PY - 2015/8
Y1 - 2015/8
N2 - The ternary Sn-1.0Ag-0.5Cu (SAC105) solders doped with a minor addition of Fe (0.1, 0.3 and 0.5 wt.%) have been shown to demonstrate excellent mechanical thermal cyclic reliability. To complement the mechanical performance, the electrical resistivities of SAC105, SAC105-0.1Fe, SAC105-0.3Fe, and SAC105-0.5Fe bulk solder alloys were also characterised after thermal aging. Results showed that the overall resistivity decreased by up to 13% after the thermal aging process. Meanwhile the electrical resistivity for 0.1 wt.%, 0.3 wt.%, and 0.5 wt.% Fe-bearing SAC105 solder alloys decreased by 25%, 11%, and 17% respectively, showing a rather stable reduction in resistivity. This can be correlated to the stabilisation of the microstructure of the Fe-added SAC 105 after thermal aging.
AB - The ternary Sn-1.0Ag-0.5Cu (SAC105) solders doped with a minor addition of Fe (0.1, 0.3 and 0.5 wt.%) have been shown to demonstrate excellent mechanical thermal cyclic reliability. To complement the mechanical performance, the electrical resistivities of SAC105, SAC105-0.1Fe, SAC105-0.3Fe, and SAC105-0.5Fe bulk solder alloys were also characterised after thermal aging. Results showed that the overall resistivity decreased by up to 13% after the thermal aging process. Meanwhile the electrical resistivity for 0.1 wt.%, 0.3 wt.%, and 0.5 wt.% Fe-bearing SAC105 solder alloys decreased by 25%, 11%, and 17% respectively, showing a rather stable reduction in resistivity. This can be correlated to the stabilisation of the microstructure of the Fe-added SAC 105 after thermal aging.
KW - Aging
KW - Lead-free solder
KW - Resistivity
KW - SAC105
UR - http://www.scopus.com/inward/record.url?scp=84943455605&partnerID=8YFLogxK
U2 - 10.1016/j.microrel.2015.06.123
DO - 10.1016/j.microrel.2015.06.123
M3 - Article
AN - SCOPUS:84943455605
VL - 55
SP - 1882
EP - 1885
JO - Microelectronics reliability
JF - Microelectronics reliability
SN - 0026-2714
IS - 9-10
ER -