Effect of SiO2 ticknesses in thermal-SiO2/PECVD-SiN stacks on surface passivation of n-Type Cz silicon substrates

Publikation: Beitrag in Buch/Bericht/Sammelwerk/KonferenzbandAufsatz in KonferenzbandForschungPeer-Review

Autoren

  • Ye Larionova
  • N. P. Harder
  • R. Brendel

Externe Organisationen

  • Institut für Solarenergieforschung GmbH (ISFH)
Forschungs-netzwerk anzeigen

Details

OriginalspracheEnglisch
Titel des Sammelwerks35th IEEE Photovoltaic Specialists Conference Honolulu, HI, June 20-25, 2010
UntertitelConference Proceedings
Seiten1207-1209
Seitenumfang3
PublikationsstatusVeröffentlicht - 2010
Veranstaltung35th IEEE Photovoltaic Specialists Conference: PVSC 2010 - Honolulu, HI, USA / Vereinigte Staaten
Dauer: 20 Juni 201025 Juni 2010
Konferenznummer: 35

Publikationsreihe

NameConference Record of the IEEE Photovoltaic Specialists Conference
ISSN (Print)0160-8371

Abstract

The influence of SiO2 thicknesses in thermal- SiO 2/PECVD-SiN stacks on surface passivation of 2.5 Ωcm n-type Czochralski silicon substrates has been investigated. By annealing theses stacks in air we achieve surface recombination velocities (SRV) better (i.e. lower) than 2.6 cm/s for thin SiO2 layers. We find a clear correlation between the thickness of the oxide layers and the annealing duration for obtaining optimum surface passivation. Furthermore, we also show that the absolute passivation quality of the SiO2/SiN stacks correlates to the SiO2thickness. We find that the SRV increases with increasing oxide thickness. We also present data of the surface passivation of these SiO 2/SiN stacks after storage in the dark for several months. We find a slight degradation of the surface passivation for thicker oxides and no observable degradation for the 10 nm thick SiO2 layer in our SiO 2/SiN stacks after 6 weeks of storage. Short annealing at 400°C in air restores the passivation quality and from then on remains unchanged for the measured storage time of 35 weeks.

ASJC Scopus Sachgebiete

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Effect of SiO2 ticknesses in thermal-SiO2/PECVD-SiN stacks on surface passivation of n-Type Cz silicon substrates. / Larionova, Ye; Harder, N. P.; Brendel, R.
35th IEEE Photovoltaic Specialists Conference Honolulu, HI, June 20-25, 2010: Conference Proceedings. 2010. S. 1207-1209 5614072 (Conference Record of the IEEE Photovoltaic Specialists Conference).

Publikation: Beitrag in Buch/Bericht/Sammelwerk/KonferenzbandAufsatz in KonferenzbandForschungPeer-Review

Larionova, Y, Harder, NP & Brendel, R 2010, Effect of SiO2 ticknesses in thermal-SiO2/PECVD-SiN stacks on surface passivation of n-Type Cz silicon substrates. in 35th IEEE Photovoltaic Specialists Conference Honolulu, HI, June 20-25, 2010: Conference Proceedings., 5614072, Conference Record of the IEEE Photovoltaic Specialists Conference, S. 1207-1209, 35th IEEE Photovoltaic Specialists Conference, Honolulu, HI, USA / Vereinigte Staaten, 20 Juni 2010. https://doi.org/10.1109/PVSC.2010.5614072
Larionova, Y., Harder, N. P., & Brendel, R. (2010). Effect of SiO2 ticknesses in thermal-SiO2/PECVD-SiN stacks on surface passivation of n-Type Cz silicon substrates. In 35th IEEE Photovoltaic Specialists Conference Honolulu, HI, June 20-25, 2010: Conference Proceedings (S. 1207-1209). Artikel 5614072 (Conference Record of the IEEE Photovoltaic Specialists Conference). https://doi.org/10.1109/PVSC.2010.5614072
Larionova Y, Harder NP, Brendel R. Effect of SiO2 ticknesses in thermal-SiO2/PECVD-SiN stacks on surface passivation of n-Type Cz silicon substrates. in 35th IEEE Photovoltaic Specialists Conference Honolulu, HI, June 20-25, 2010: Conference Proceedings. 2010. S. 1207-1209. 5614072. (Conference Record of the IEEE Photovoltaic Specialists Conference). doi: 10.1109/PVSC.2010.5614072
Larionova, Ye ; Harder, N. P. ; Brendel, R. / Effect of SiO2 ticknesses in thermal-SiO2/PECVD-SiN stacks on surface passivation of n-Type Cz silicon substrates. 35th IEEE Photovoltaic Specialists Conference Honolulu, HI, June 20-25, 2010: Conference Proceedings. 2010. S. 1207-1209 (Conference Record of the IEEE Photovoltaic Specialists Conference).
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@inproceedings{1659f051422f438babb4091bac46a4a3,
title = "Effect of SiO2 ticknesses in thermal-SiO2/PECVD-SiN stacks on surface passivation of n-Type Cz silicon substrates",
abstract = "The influence of SiO2 thicknesses in thermal- SiO 2/PECVD-SiN stacks on surface passivation of 2.5 Ωcm n-type Czochralski silicon substrates has been investigated. By annealing theses stacks in air we achieve surface recombination velocities (SRV) better (i.e. lower) than 2.6 cm/s for thin SiO2 layers. We find a clear correlation between the thickness of the oxide layers and the annealing duration for obtaining optimum surface passivation. Furthermore, we also show that the absolute passivation quality of the SiO2/SiN stacks correlates to the SiO2thickness. We find that the SRV increases with increasing oxide thickness. We also present data of the surface passivation of these SiO 2/SiN stacks after storage in the dark for several months. We find a slight degradation of the surface passivation for thicker oxides and no observable degradation for the 10 nm thick SiO2 layer in our SiO 2/SiN stacks after 6 weeks of storage. Short annealing at 400°C in air restores the passivation quality and from then on remains unchanged for the measured storage time of 35 weeks.",
author = "Ye Larionova and Harder, {N. P.} and R. Brendel",
note = "Funding Information: The authors thank H. Kohlenberg for help with sample preparation. The financial support of this work by the state of Lower Saxony (Germany) is gratefully acknowledged.; 35th IEEE Photovoltaic Specialists Conference, PVSC 2010 ; Conference date: 20-06-2010 Through 25-06-2010",
year = "2010",
doi = "10.1109/PVSC.2010.5614072",
language = "English",
isbn = "9781424458912",
series = "Conference Record of the IEEE Photovoltaic Specialists Conference",
pages = "1207--1209",
booktitle = "35th IEEE Photovoltaic Specialists Conference Honolulu, HI, June 20-25, 2010",

}

Download

TY - GEN

T1 - Effect of SiO2 ticknesses in thermal-SiO2/PECVD-SiN stacks on surface passivation of n-Type Cz silicon substrates

AU - Larionova, Ye

AU - Harder, N. P.

AU - Brendel, R.

N1 - Conference code: 35

PY - 2010

Y1 - 2010

N2 - The influence of SiO2 thicknesses in thermal- SiO 2/PECVD-SiN stacks on surface passivation of 2.5 Ωcm n-type Czochralski silicon substrates has been investigated. By annealing theses stacks in air we achieve surface recombination velocities (SRV) better (i.e. lower) than 2.6 cm/s for thin SiO2 layers. We find a clear correlation between the thickness of the oxide layers and the annealing duration for obtaining optimum surface passivation. Furthermore, we also show that the absolute passivation quality of the SiO2/SiN stacks correlates to the SiO2thickness. We find that the SRV increases with increasing oxide thickness. We also present data of the surface passivation of these SiO 2/SiN stacks after storage in the dark for several months. We find a slight degradation of the surface passivation for thicker oxides and no observable degradation for the 10 nm thick SiO2 layer in our SiO 2/SiN stacks after 6 weeks of storage. Short annealing at 400°C in air restores the passivation quality and from then on remains unchanged for the measured storage time of 35 weeks.

AB - The influence of SiO2 thicknesses in thermal- SiO 2/PECVD-SiN stacks on surface passivation of 2.5 Ωcm n-type Czochralski silicon substrates has been investigated. By annealing theses stacks in air we achieve surface recombination velocities (SRV) better (i.e. lower) than 2.6 cm/s for thin SiO2 layers. We find a clear correlation between the thickness of the oxide layers and the annealing duration for obtaining optimum surface passivation. Furthermore, we also show that the absolute passivation quality of the SiO2/SiN stacks correlates to the SiO2thickness. We find that the SRV increases with increasing oxide thickness. We also present data of the surface passivation of these SiO 2/SiN stacks after storage in the dark for several months. We find a slight degradation of the surface passivation for thicker oxides and no observable degradation for the 10 nm thick SiO2 layer in our SiO 2/SiN stacks after 6 weeks of storage. Short annealing at 400°C in air restores the passivation quality and from then on remains unchanged for the measured storage time of 35 weeks.

UR - http://www.scopus.com/inward/record.url?scp=78650139171&partnerID=8YFLogxK

U2 - 10.1109/PVSC.2010.5614072

DO - 10.1109/PVSC.2010.5614072

M3 - Conference contribution

AN - SCOPUS:78650139171

SN - 9781424458912

T3 - Conference Record of the IEEE Photovoltaic Specialists Conference

SP - 1207

EP - 1209

BT - 35th IEEE Photovoltaic Specialists Conference Honolulu, HI, June 20-25, 2010

T2 - 35th IEEE Photovoltaic Specialists Conference, PVSC 2010

Y2 - 20 June 2010 through 25 June 2010

ER -