Details
| Originalsprache | Englisch |
|---|---|
| Seiten (von - bis) | 1606-1610 |
| Seitenumfang | 5 |
| Fachzeitschrift | Microelectronics reliability |
| Jahrgang | 53 |
| Ausgabenummer | 9-11 |
| Publikationsstatus | Veröffentlicht - Sept. 2013 |
Abstract
Robust metallizations for harsh environment and high current applications in integrated circuits are required for automotive or industrial applications. To achieve a higher current capability so called "power metals" are used. The new concept of slotted geometries shows a better robustness towards degradation due to electromigration. This is a new design concept which is contrary to the conventional concept to use homogeneous filled metal tracks. A reliability investigation of octahedron-shaped slots in metal tracks was carried out by dynamic simulations. The determination thermal-electrical-mechanical behaviour was simulated with the finite element software ANSYS®.
ASJC Scopus Sachgebiete
- Werkstoffwissenschaften (insg.)
- Elektronische, optische und magnetische Materialien
- Physik und Astronomie (insg.)
- Atom- und Molekularphysik sowie Optik
- Ingenieurwesen (insg.)
- Sicherheit, Risiko, Zuverlässigkeit und Qualität
- Physik und Astronomie (insg.)
- Physik der kondensierten Materie
- Werkstoffwissenschaften (insg.)
- Oberflächen, Beschichtungen und Folien
- Ingenieurwesen (insg.)
- Elektrotechnik und Elektronik
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in: Microelectronics reliability, Jahrgang 53, Nr. 9-11, 09.2013, S. 1606-1610.
Publikation: Beitrag in Fachzeitschrift › Artikel › Forschung › Peer-Review
}
TY - JOUR
T1 - Dynamic simulation of octahedron slotted metal structures
AU - Kludt, J.
AU - Weide-Zaage, K.
AU - Ackermann, M.
AU - Hein, V.
N1 - Funding Information: This collaboration was supported by RELY – Design for RELIABILITY (16M3091B). A part of the European CATRENE programme for research and development. Copyright: Copyright 2013 Elsevier B.V., All rights reserved.
PY - 2013/9
Y1 - 2013/9
N2 - Robust metallizations for harsh environment and high current applications in integrated circuits are required for automotive or industrial applications. To achieve a higher current capability so called "power metals" are used. The new concept of slotted geometries shows a better robustness towards degradation due to electromigration. This is a new design concept which is contrary to the conventional concept to use homogeneous filled metal tracks. A reliability investigation of octahedron-shaped slots in metal tracks was carried out by dynamic simulations. The determination thermal-electrical-mechanical behaviour was simulated with the finite element software ANSYS®.
AB - Robust metallizations for harsh environment and high current applications in integrated circuits are required for automotive or industrial applications. To achieve a higher current capability so called "power metals" are used. The new concept of slotted geometries shows a better robustness towards degradation due to electromigration. This is a new design concept which is contrary to the conventional concept to use homogeneous filled metal tracks. A reliability investigation of octahedron-shaped slots in metal tracks was carried out by dynamic simulations. The determination thermal-electrical-mechanical behaviour was simulated with the finite element software ANSYS®.
UR - http://www.scopus.com/inward/record.url?scp=84886925614&partnerID=8YFLogxK
U2 - 10.1016/j.microrel.2013.07.059
DO - 10.1016/j.microrel.2013.07.059
M3 - Article
AN - SCOPUS:84886925614
VL - 53
SP - 1606
EP - 1610
JO - Microelectronics reliability
JF - Microelectronics reliability
SN - 0026-2714
IS - 9-11
ER -