Dressing of micro profiles by wire electro discharge dressing

Publikation: Beitrag in Buch/Bericht/Sammelwerk/KonferenzbandAufsatz in KonferenzbandForschungPeer-Review

Autorschaft

  • B. Denkena
  • L. De Leon
  • D. Hahmann
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Details

OriginalspracheEnglisch
Titel des SammelwerksProceedings of the 9th International Conference of the European Society for Precision Engineering and Nanotechnology, EUSPEN 2009
Herausgeber/-innenHendrik Van Brussel, Theresa Burke, H. Spaan, E. Brinksmeier, Theresa Burke, Theresa Burke
Seiten146-149
Seitenumfang4
ISBN (elektronisch)9780955308260
PublikationsstatusVeröffentlicht - 1 Jan. 2009
Veranstaltung9th International Conference of the European Society for Precision Engineering and Nanotechnology, EUSPEN 2009 - San Sebastian, Spanien
Dauer: 2 Juni 20095 Juni 2009

Publikationsreihe

NameProceedings of the 9th International Conference of the European Society for Precision Engineering and Nanotechnology, EUSPEN 2009
Band2

Abstract

Metallic bonded multilayered grinding wheels offer high potential for low part shape tolerances in micro machining due to their low wear and high profile retention. The main problem is the dressing technology for those tools. A promising technique is the electro contact discharge dressing (ECDD), which is so far only able to generate simple profiles due to the size of the electrode. However, the size of the electrode can be reduced to a thin copper wire electrode to enable the generation of more complex or multi profiles, which is presented in this paper.

ASJC Scopus Sachgebiete

Zitieren

Dressing of micro profiles by wire electro discharge dressing. / Denkena, B.; De Leon, L.; Hahmann, D.
Proceedings of the 9th International Conference of the European Society for Precision Engineering and Nanotechnology, EUSPEN 2009. Hrsg. / Hendrik Van Brussel; Theresa Burke; H. Spaan; E. Brinksmeier; Theresa Burke; Theresa Burke. 2009. S. 146-149 (Proceedings of the 9th International Conference of the European Society for Precision Engineering and Nanotechnology, EUSPEN 2009; Band 2).

Publikation: Beitrag in Buch/Bericht/Sammelwerk/KonferenzbandAufsatz in KonferenzbandForschungPeer-Review

Denkena, B, De Leon, L & Hahmann, D 2009, Dressing of micro profiles by wire electro discharge dressing. in H Van Brussel, T Burke, H Spaan, E Brinksmeier, T Burke & T Burke (Hrsg.), Proceedings of the 9th International Conference of the European Society for Precision Engineering and Nanotechnology, EUSPEN 2009. Proceedings of the 9th International Conference of the European Society for Precision Engineering and Nanotechnology, EUSPEN 2009, Bd. 2, S. 146-149, 9th International Conference of the European Society for Precision Engineering and Nanotechnology, EUSPEN 2009, San Sebastian, Spanien, 2 Juni 2009.
Denkena, B., De Leon, L., & Hahmann, D. (2009). Dressing of micro profiles by wire electro discharge dressing. In H. Van Brussel, T. Burke, H. Spaan, E. Brinksmeier, T. Burke, & T. Burke (Hrsg.), Proceedings of the 9th International Conference of the European Society for Precision Engineering and Nanotechnology, EUSPEN 2009 (S. 146-149). (Proceedings of the 9th International Conference of the European Society for Precision Engineering and Nanotechnology, EUSPEN 2009; Band 2).
Denkena B, De Leon L, Hahmann D. Dressing of micro profiles by wire electro discharge dressing. in Van Brussel H, Burke T, Spaan H, Brinksmeier E, Burke T, Burke T, Hrsg., Proceedings of the 9th International Conference of the European Society for Precision Engineering and Nanotechnology, EUSPEN 2009. 2009. S. 146-149. (Proceedings of the 9th International Conference of the European Society for Precision Engineering and Nanotechnology, EUSPEN 2009).
Denkena, B. ; De Leon, L. ; Hahmann, D. / Dressing of micro profiles by wire electro discharge dressing. Proceedings of the 9th International Conference of the European Society for Precision Engineering and Nanotechnology, EUSPEN 2009. Hrsg. / Hendrik Van Brussel ; Theresa Burke ; H. Spaan ; E. Brinksmeier ; Theresa Burke ; Theresa Burke. 2009. S. 146-149 (Proceedings of the 9th International Conference of the European Society for Precision Engineering and Nanotechnology, EUSPEN 2009).
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