Details
| Originalsprache | Englisch |
|---|---|
| Aufsatznummer | 6974991 |
| Seiten (von - bis) | 195-201 |
| Seitenumfang | 7 |
| Fachzeitschrift | IEEE journal of photovoltaics |
| Jahrgang | 5 |
| Ausgabenummer | 1 |
| Publikationsstatus | Veröffentlicht - 1 Jan. 2015 |
Abstract
The fabrication of thin solar cells by kerfless wafering techniques offers a high potential for the reduction of photovoltaic costs. We present an experimental setup for the exfoliation of thin crystalline silicon foils from a silicon substrate induced by the difference in thermal expansion coefficient of the silicon and an aluminum stressor layer at moderate temperatures. A moving temperature gradient across the substrate controls the crack propagation parallel to the silicon surface. We measure and simulate the spatial temperature distribution during thermal treatment and find that the direction of crack propagation is controlled by the temperature distribution. We detach foils with an area of 19.6 cm2 with thickness values ranging from 50 to 80 μm within one layer. The foils have a smooth surface with some irregularities near the edge.
ASJC Scopus Sachgebiete
- Werkstoffwissenschaften (insg.)
- Elektronische, optische und magnetische Materialien
- Physik und Astronomie (insg.)
- Physik der kondensierten Materie
- Ingenieurwesen (insg.)
- Elektrotechnik und Elektronik
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in: IEEE journal of photovoltaics, Jahrgang 5, Nr. 1, 6974991, 01.01.2015, S. 195-201.
Publikation: Beitrag in Fachzeitschrift › Artikel › Forschung › Peer-Review
}
TY - JOUR
T1 - Directional heating and cooling for controlled spalling
AU - Hensen, Jan
AU - Niepelt, Raphael
AU - Kajari-Schroder, Sarah
AU - Brendel, Rolf
N1 - Publisher Copyright: © 2011-2012 IEEE.
PY - 2015/1/1
Y1 - 2015/1/1
N2 - The fabrication of thin solar cells by kerfless wafering techniques offers a high potential for the reduction of photovoltaic costs. We present an experimental setup for the exfoliation of thin crystalline silicon foils from a silicon substrate induced by the difference in thermal expansion coefficient of the silicon and an aluminum stressor layer at moderate temperatures. A moving temperature gradient across the substrate controls the crack propagation parallel to the silicon surface. We measure and simulate the spatial temperature distribution during thermal treatment and find that the direction of crack propagation is controlled by the temperature distribution. We detach foils with an area of 19.6 cm2 with thickness values ranging from 50 to 80 μm within one layer. The foils have a smooth surface with some irregularities near the edge.
AB - The fabrication of thin solar cells by kerfless wafering techniques offers a high potential for the reduction of photovoltaic costs. We present an experimental setup for the exfoliation of thin crystalline silicon foils from a silicon substrate induced by the difference in thermal expansion coefficient of the silicon and an aluminum stressor layer at moderate temperatures. A moving temperature gradient across the substrate controls the crack propagation parallel to the silicon surface. We measure and simulate the spatial temperature distribution during thermal treatment and find that the direction of crack propagation is controlled by the temperature distribution. We detach foils with an area of 19.6 cm2 with thickness values ranging from 50 to 80 μm within one layer. The foils have a smooth surface with some irregularities near the edge.
KW - Crystalline materials
KW - kerfless wafering
KW - silicon
KW - thermomechanical processes
KW - Thin films
UR - http://www.scopus.com/inward/record.url?scp=84919787085&partnerID=8YFLogxK
U2 - 10.1109/JPHOTOV.2014.2371233
DO - 10.1109/JPHOTOV.2014.2371233
M3 - Article
AN - SCOPUS:84919787085
VL - 5
SP - 195
EP - 201
JO - IEEE journal of photovoltaics
JF - IEEE journal of photovoltaics
SN - 2156-3381
IS - 1
M1 - 6974991
ER -