Direct precision manufacturing of three-dimensional components using organically modified ceramics

Publikation: Beitrag in FachzeitschriftArtikelForschungPeer-Review

Autoren

  • Ludger Overmeyer
  • André Neumeister
  • Rainer Kling

Externe Organisationen

  • Laser Zentrum Hannover e.V. (LZH)
Forschungs-netzwerk anzeigen

Details

OriginalspracheEnglisch
Seiten (von - bis)267-270
Seitenumfang4
FachzeitschriftCIRP Annals - Manufacturing Technology
Jahrgang60
Ausgabenummer1
PublikationsstatusVeröffentlicht - 13 Apr. 2011
Extern publiziertJa

Abstract

The authors report on direct precision manufacturing (DPM) of three-dimensional parts using the stereo lithography technique. Organically modified ceramics (Ormocer) are photo polymerised in a layer based production fashion with a custom designed micro stereo lithography (MSL) apparatus. In order to achieve spatial process resolutions as high as 10 μm, both the Ormocer and apparatus are adapted in terms of high resolution manufacturing. Using micro computer tomography, form tolerances smaller than 50 μm are achieved. Through the highest degree of flexibility in three-dimensional manufacturing, new fields of applications in the MEMS sector are conceivable, as exemplary micro mechanical or micro fluidic systems.

ASJC Scopus Sachgebiete

Zitieren

Direct precision manufacturing of three-dimensional components using organically modified ceramics. / Overmeyer, Ludger; Neumeister, André; Kling, Rainer.
in: CIRP Annals - Manufacturing Technology, Jahrgang 60, Nr. 1, 13.04.2011, S. 267-270.

Publikation: Beitrag in FachzeitschriftArtikelForschungPeer-Review

Overmeyer L, Neumeister A, Kling R. Direct precision manufacturing of three-dimensional components using organically modified ceramics. CIRP Annals - Manufacturing Technology. 2011 Apr 13;60(1):267-270. doi: 10.1016/j.cirp.2011.03.067
Overmeyer, Ludger ; Neumeister, André ; Kling, Rainer. / Direct precision manufacturing of three-dimensional components using organically modified ceramics. in: CIRP Annals - Manufacturing Technology. 2011 ; Jahrgang 60, Nr. 1. S. 267-270.
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