Details
| Originalsprache | Englisch |
|---|---|
| Aufsatznummer | 034506 |
| Fachzeitschrift | Journal of Micro/ Nanolithography, MEMS, and MOEMS |
| Jahrgang | 15 |
| Ausgabenummer | 3 |
| Publikationsstatus | Veröffentlicht - 23 Aug. 2016 |
Abstract
While automatic hot embossing systems are available for large- and small-scale productions of polymeric devices, one of the process challenges remains to be the manufacturing of precise, durable, and yet inexpensive hot embossing stamps. The use of metallic stamps manufactured by electroplating a photoresist pattern or by precision milling and their replication into silicone molds with UV-lithography, electroplating, and molding techniques is state of the art. Yet, there have been few, if any, thriving attempts to directly emboss polymers by means of bare photoresists, and in particular polyimide-based photoresists, without transferring the photoresist patterns into a different stamp material. We conduct a proof-of-concept by developing hot embossing stamps based on photosensitive polyimide. We focus primarily on the reliability of the aforementioned stamps throughout the hot embossing cycle and the fidelity of pattern transfer onto polymeric films for different microstructural patterns.
ASJC Scopus Sachgebiete
- Werkstoffwissenschaften (insg.)
- Elektronische, optische und magnetische Materialien
- Physik und Astronomie (insg.)
- Atom- und Molekularphysik sowie Optik
- Physik und Astronomie (insg.)
- Physik der kondensierten Materie
- Ingenieurwesen (insg.)
- Maschinenbau
- Ingenieurwesen (insg.)
- Elektrotechnik und Elektronik
Zitieren
- Standard
- Harvard
- Apa
- Vancouver
- BibTex
- RIS
in: Journal of Micro/ Nanolithography, MEMS, and MOEMS, Jahrgang 15, Nr. 3, 034506, 23.08.2016.
Publikation: Beitrag in Fachzeitschrift › Artikel › Forschung › Peer-Review
}
TY - JOUR
T1 - Direct hot embossing of microelements by means of photostructurable polyimide
AU - Akin, Meriem
AU - Rezem, Maher
AU - Rahlves, Maik
AU - Cromwell, Kevin
AU - Roth, Bernhard
AU - Reithmeier, Eduard
AU - Wurz, Marc Christopher
AU - Rissing, Lutz
AU - Maier, Hans Juergen
PY - 2016/8/23
Y1 - 2016/8/23
N2 - While automatic hot embossing systems are available for large- and small-scale productions of polymeric devices, one of the process challenges remains to be the manufacturing of precise, durable, and yet inexpensive hot embossing stamps. The use of metallic stamps manufactured by electroplating a photoresist pattern or by precision milling and their replication into silicone molds with UV-lithography, electroplating, and molding techniques is state of the art. Yet, there have been few, if any, thriving attempts to directly emboss polymers by means of bare photoresists, and in particular polyimide-based photoresists, without transferring the photoresist patterns into a different stamp material. We conduct a proof-of-concept by developing hot embossing stamps based on photosensitive polyimide. We focus primarily on the reliability of the aforementioned stamps throughout the hot embossing cycle and the fidelity of pattern transfer onto polymeric films for different microstructural patterns.
AB - While automatic hot embossing systems are available for large- and small-scale productions of polymeric devices, one of the process challenges remains to be the manufacturing of precise, durable, and yet inexpensive hot embossing stamps. The use of metallic stamps manufactured by electroplating a photoresist pattern or by precision milling and their replication into silicone molds with UV-lithography, electroplating, and molding techniques is state of the art. Yet, there have been few, if any, thriving attempts to directly emboss polymers by means of bare photoresists, and in particular polyimide-based photoresists, without transferring the photoresist patterns into a different stamp material. We conduct a proof-of-concept by developing hot embossing stamps based on photosensitive polyimide. We focus primarily on the reliability of the aforementioned stamps throughout the hot embossing cycle and the fidelity of pattern transfer onto polymeric films for different microstructural patterns.
KW - fluidic systems
KW - hot embossing
KW - optical devices
KW - polyimide
KW - stamp fabrication
KW - stamp reliability
UR - http://www.scopus.com/inward/record.url?scp=84983745976&partnerID=8YFLogxK
U2 - 10.1117/1.JMM.15.3.034506
DO - 10.1117/1.JMM.15.3.034506
M3 - Article
AN - SCOPUS:84983745976
VL - 15
JO - Journal of Micro/ Nanolithography, MEMS, and MOEMS
JF - Journal of Micro/ Nanolithography, MEMS, and MOEMS
SN - 1932-5150
IS - 3
M1 - 034506
ER -