Details
| Originalsprache | Englisch |
|---|---|
| Aufsatznummer | 012005 |
| Fachzeitschrift | IOP Conference Series: Materials Science and Engineering |
| Jahrgang | 181 |
| Ausgabenummer | 1 |
| Publikationsstatus | Veröffentlicht - 17 März 2017 |
| Veranstaltung | 19th Chemnitz Seminar on Materials Engineering - Chemnitz, Deutschland Dauer: 16 März 2017 → 17 März 2017 |
Abstract
Objective of the project presented is the development of a joining process for hot working steel components at low brazing temperatures leading to a bond with a much higher remelting temperature. This basically is achieved by the use of a Cu-Sn melt spinning foil combined with a pure Cu foil. During brazing, the Sn content of the foil is decreased by diffusion of Sn into the additional Cu resulting in a homogenious joint with a increased remelting temperature of the filler metal. Within this project specimens were brazed and diffusion annealed in a vacuum furnace at 850 °C varying the processing times (0 - 10 h). The samples prepared were studied metallographically and diffusion profiles of Sn were recorded using EDX line scans. The results are discussed in view of further investigations and envisaged applications.
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in: IOP Conference Series: Materials Science and Engineering, Jahrgang 181, Nr. 1, 012005, 17.03.2017.
Publikation: Beitrag in Fachzeitschrift › Konferenzaufsatz in Fachzeitschrift › Forschung › Peer-Review
}
TY - JOUR
T1 - Development of a Cu-Sn based brazing system with a low brazing and a high remelting temperature
AU - Schmieding, Maurice
AU - Holländer, Ulrich
AU - Möhwald, Kai
N1 - Publisher Copyright: © Published under licence by IOP Publishing Ltd. Copyright: Copyright 2017 Elsevier B.V., All rights reserved.
PY - 2017/3/17
Y1 - 2017/3/17
N2 - Objective of the project presented is the development of a joining process for hot working steel components at low brazing temperatures leading to a bond with a much higher remelting temperature. This basically is achieved by the use of a Cu-Sn melt spinning foil combined with a pure Cu foil. During brazing, the Sn content of the foil is decreased by diffusion of Sn into the additional Cu resulting in a homogenious joint with a increased remelting temperature of the filler metal. Within this project specimens were brazed and diffusion annealed in a vacuum furnace at 850 °C varying the processing times (0 - 10 h). The samples prepared were studied metallographically and diffusion profiles of Sn were recorded using EDX line scans. The results are discussed in view of further investigations and envisaged applications.
AB - Objective of the project presented is the development of a joining process for hot working steel components at low brazing temperatures leading to a bond with a much higher remelting temperature. This basically is achieved by the use of a Cu-Sn melt spinning foil combined with a pure Cu foil. During brazing, the Sn content of the foil is decreased by diffusion of Sn into the additional Cu resulting in a homogenious joint with a increased remelting temperature of the filler metal. Within this project specimens were brazed and diffusion annealed in a vacuum furnace at 850 °C varying the processing times (0 - 10 h). The samples prepared were studied metallographically and diffusion profiles of Sn were recorded using EDX line scans. The results are discussed in view of further investigations and envisaged applications.
UR - http://www.scopus.com/inward/record.url?scp=85016614327&partnerID=8YFLogxK
U2 - 10.1088/1757-899X/181/1/012005
DO - 10.1088/1757-899X/181/1/012005
M3 - Conference article
AN - SCOPUS:85016614327
VL - 181
JO - IOP Conference Series: Materials Science and Engineering
JF - IOP Conference Series: Materials Science and Engineering
SN - 1757-8981
IS - 1
M1 - 012005
T2 - 19th Chemnitz Seminar on Materials Engineering
Y2 - 16 March 2017 through 17 March 2017
ER -