Details
| Originalsprache | Englisch |
|---|---|
| Titel des Sammelwerks | Electrical Performance of Electronic Packaging |
| Herausgeber (Verlag) | Institute of Electrical and Electronics Engineers Inc. |
| Seiten | 97-100 |
| Seitenumfang | 4 |
| ISBN (elektronisch) | 0780381289, 9780780381285 |
| Publikationsstatus | Veröffentlicht - 2003 |
| Veranstaltung | Electrical Performance of Electronic Packaging, 2003 - Princeton, USA / Vereinigte Staaten Dauer: 27 Okt. 2003 → 29 Okt. 2003 |
Publikationsreihe
| Name | Electrical Performance of Electronic Packaging |
|---|
Abstract
The frequency dependent propagation constant, characteristic impedance as well as the R, L, C and G parameters will be determined from on chip S-parameter measurements. The transmission line test structures are embedded in a multi layer test chip. Measurement limitations due to non ideal chip environment will be shown and discussed. Measured and simulated results show a very good agreement.
ASJC Scopus Sachgebiete
- Ingenieurwesen (insg.)
- Elektrotechnik und Elektronik
- Informatik (insg.)
- Hardware und Architektur
Zitieren
- Standard
- Harvard
- Apa
- Vancouver
- BibTex
- RIS
Electrical Performance of Electronic Packaging. Institute of Electrical and Electronics Engineers Inc., 2003. S. 97-100 1250008 (Electrical Performance of Electronic Packaging).
Publikation: Beitrag in Buch/Bericht/Sammelwerk/Konferenzband › Aufsatz in Konferenzband › Forschung › Peer-Review
}
TY - GEN
T1 - Determination of frequency dependent transmission line parameters on product related on chip test line structures using s-parameter measurements
AU - Winkel, Thomas Michael
AU - Faiez Ktata, M.
AU - Ludwig, Thomas
AU - Scheltler, Helmut
AU - Grabinski, Hartmut
AU - Klink, Erich
PY - 2003
Y1 - 2003
N2 - The frequency dependent propagation constant, characteristic impedance as well as the R, L, C and G parameters will be determined from on chip S-parameter measurements. The transmission line test structures are embedded in a multi layer test chip. Measurement limitations due to non ideal chip environment will be shown and discussed. Measured and simulated results show a very good agreement.
AB - The frequency dependent propagation constant, characteristic impedance as well as the R, L, C and G parameters will be determined from on chip S-parameter measurements. The transmission line test structures are embedded in a multi layer test chip. Measurement limitations due to non ideal chip environment will be shown and discussed. Measured and simulated results show a very good agreement.
UR - http://www.scopus.com/inward/record.url?scp=84889284589&partnerID=8YFLogxK
U2 - 10.1109/EPEP.2003.1250008
DO - 10.1109/EPEP.2003.1250008
M3 - Conference contribution
AN - SCOPUS:84889284589
T3 - Electrical Performance of Electronic Packaging
SP - 97
EP - 100
BT - Electrical Performance of Electronic Packaging
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - Electrical Performance of Electronic Packaging, 2003
Y2 - 27 October 2003 through 29 October 2003
ER -