Details
| Originalsprache | Englisch |
|---|---|
| Titel des Sammelwerks | 2013 IEEE International Integrated Reliability Workshop Final Report, IIRW 2013 |
| Herausgeber (Verlag) | Institute of Electrical and Electronics Engineers Inc. |
| Seiten | 161-165 |
| Seitenumfang | 5 |
| ISBN (Print) | 9781479903504 |
| Publikationsstatus | Veröffentlicht - 2013 |
| Veranstaltung | 2013 IEEE International Integrated Reliability Workshop Final Report, IIRW 2013 - South Lake Tahoe, CA, USA / Vereinigte Staaten Dauer: 13 Okt. 2013 → 17 Okt. 2013 |
Publikationsreihe
| Name | IEEE International Integrated Reliability Workshop Final Report |
|---|
Abstract
The advantage of an increased lifetime of slotted metal tracks for the use in integrated circuits has already been shown. A benefit for slotted metal track geometries especially for thick metal tracks under DC and DC pulsed stress test conditions could be confirmed by lifetime measurements. To achieve a higher current capability these metal tracks, also known as 'power metals', were used in upper metallization layers. This new design concept shows a better robustness towards electromigration in comparison to conventional wide unslotted metal tracks. A new concept deals with the use of slotted geometries in lower metallization layers. Simulations show a decrease of von Mises stress in comparison to unslotted metal tracks. This behaviour can reduce the current shift of active and passive devices due to the imposed stress of the lower metallization layers.
ASJC Scopus Sachgebiete
- Ingenieurwesen (insg.)
- Elektrotechnik und Elektronik
- Ingenieurwesen (insg.)
- Sicherheit, Risiko, Zuverlässigkeit und Qualität
- Werkstoffwissenschaften (insg.)
- Elektronische, optische und magnetische Materialien
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2013 IEEE International Integrated Reliability Workshop Final Report, IIRW 2013. Institute of Electrical and Electronics Engineers Inc., 2013. S. 161-165 6804184 (IEEE International Integrated Reliability Workshop Final Report).
Publikation: Beitrag in Buch/Bericht/Sammelwerk/Konferenzband › Aufsatz in Konferenzband › Forschung › Peer-Review
}
TY - GEN
T1 - Deformation of octahedron slotted metal tracks
AU - Kludt, Jörg
AU - Weide-Zaage, Kirsten
AU - Ackermann, Markus
AU - Hein, Verena
N1 - Copyright: Copyright 2014 Elsevier B.V., All rights reserved.
PY - 2013
Y1 - 2013
N2 - The advantage of an increased lifetime of slotted metal tracks for the use in integrated circuits has already been shown. A benefit for slotted metal track geometries especially for thick metal tracks under DC and DC pulsed stress test conditions could be confirmed by lifetime measurements. To achieve a higher current capability these metal tracks, also known as 'power metals', were used in upper metallization layers. This new design concept shows a better robustness towards electromigration in comparison to conventional wide unslotted metal tracks. A new concept deals with the use of slotted geometries in lower metallization layers. Simulations show a decrease of von Mises stress in comparison to unslotted metal tracks. This behaviour can reduce the current shift of active and passive devices due to the imposed stress of the lower metallization layers.
AB - The advantage of an increased lifetime of slotted metal tracks for the use in integrated circuits has already been shown. A benefit for slotted metal track geometries especially for thick metal tracks under DC and DC pulsed stress test conditions could be confirmed by lifetime measurements. To achieve a higher current capability these metal tracks, also known as 'power metals', were used in upper metallization layers. This new design concept shows a better robustness towards electromigration in comparison to conventional wide unslotted metal tracks. A new concept deals with the use of slotted geometries in lower metallization layers. Simulations show a decrease of von Mises stress in comparison to unslotted metal tracks. This behaviour can reduce the current shift of active and passive devices due to the imposed stress of the lower metallization layers.
UR - http://www.scopus.com/inward/record.url?scp=84900503894&partnerID=8YFLogxK
U2 - 10.1109/IIRW.2013.6804184
DO - 10.1109/IIRW.2013.6804184
M3 - Conference contribution
AN - SCOPUS:84900503894
SN - 9781479903504
T3 - IEEE International Integrated Reliability Workshop Final Report
SP - 161
EP - 165
BT - 2013 IEEE International Integrated Reliability Workshop Final Report, IIRW 2013
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2013 IEEE International Integrated Reliability Workshop Final Report, IIRW 2013
Y2 - 13 October 2013 through 17 October 2013
ER -