Defect imaging in multicrystalline silicon using a lock-in infrared camera technique

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  • Institut für Solarenergieforschung GmbH (ISFH)
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Details

OriginalspracheEnglisch
Aufsatznummer073701
FachzeitschriftJournal of applied physics
Jahrgang101
Ausgabenummer7
Frühes Online-Datum2 Apr. 2007
PublikationsstatusVeröffentlicht - 2007
Extern publiziertJa

Abstract

We image the lifetime distribution of multicrystalline silicon wafers by means of calibrated measurements of the free-carrier emission using an infrared camera. The spatially resolved lifetime measurements are performed as a function of the light-generated excess carrier density, showing a pronounced increase in lifetime with decreasing injection density at very low injection levels. Two theoretical models are applied to describe the abnormal lifetime increase: (i) minority-carrier trapping and (ii) depletion region modulation around charged bulk defects. The trapping model is found to give better agreement with the experimental data. By fitting the trapping model to each point of the lifetime image recorded at different injection levels, we generate a trap density mapping. On multicrystalline silicon wafers we find a clear correlation between trap and dislocation densitymappings.

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Defect imaging in multicrystalline silicon using a lock-in infrared camera technique. / Pohl, Peter; Schmidt, Jan; Schmiga, Christian et al.
in: Journal of applied physics, Jahrgang 101, Nr. 7, 073701, 2007.

Publikation: Beitrag in FachzeitschriftArtikelForschungPeer-Review

Pohl P, Schmidt J, Schmiga C, Brendel R. Defect imaging in multicrystalline silicon using a lock-in infrared camera technique. Journal of applied physics. 2007;101(7):073701. Epub 2007 Apr 2. doi: 10.1063/1.2713933
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AU - Schmidt, Jan

AU - Schmiga, Christian

AU - Brendel, Rolf

N1 - Funding Information: Funding was provided by the State of Lower Saxony and the German Federal Ministry for the Environment, Nature Conservation, and Nuclear Safety (BMU). The authors are grateful to N. Enjalbert of Photowatt International S.A.S (France) for supplying mc-Si wafers. The authors gratefully acknowledge fruitful discussions with K. Bothe, B. Fischer, and N. P. Harder. ISFH is a member of the German Forschungsverbund Sonnenenergie.

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