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Das Einzelkornschleifen: Methode zur Analyse der Einzelkornbelastung und deren Auswirkungen auf den Verschleiß beim Schleifen

Publikation: Beitrag in FachzeitschriftArtikelForschungPeer-Review

Autorschaft

  • B. Denkena
  • T. Grove
  • A. Bouabid

Details

Titel in ÜbersetzungThe single grain grinding
OriginalspracheDeutsch
Seiten (von - bis)448-452
Seitenumfang5
FachzeitschriftWT Werkstattstechnik
Jahrgang107
Ausgabenummer6
PublikationsstatusVeröffentlicht - Juni 2017

Abstract

The presented method represents an advancement of the scratching process. The grain is attached to the scratching tool, which is manufactured on the basis of a real grinding wheel. Thus, the influence of the bond on the chip formation and wear behavior at the grain level is taken into account. A realistic single grain load can be determined and used for the design of grinding tools.

ASJC Scopus Sachgebiete

Zitieren

Das Einzelkornschleifen: Methode zur Analyse der Einzelkornbelastung und deren Auswirkungen auf den Verschleiß beim Schleifen. / Denkena, B.; Grove, T.; Bouabid, A.
in: WT Werkstattstechnik, Jahrgang 107, Nr. 6, 06.2017, S. 448-452.

Publikation: Beitrag in FachzeitschriftArtikelForschungPeer-Review

Denkena, B. ; Grove, T. ; Bouabid, A. / Das Einzelkornschleifen : Methode zur Analyse der Einzelkornbelastung und deren Auswirkungen auf den Verschleiß beim Schleifen. in: WT Werkstattstechnik. 2017 ; Jahrgang 107, Nr. 6. S. 448-452.
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