Details
Originalsprache | Englisch |
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Titel des Sammelwerks | Proceedings - 8th IEEE Workshop on Signal Propagation on Interconnects |
Seiten | 85-88 |
Seitenumfang | 4 |
Publikationsstatus | Veröffentlicht - 2004 |
Veranstaltung | 8th IEEE Workshop on Signal Propagation on Interconnects - Heidelberg, Deutschland Dauer: 9 Mai 2004 → 12 Mai 2004 |
Publikationsreihe
Name | Proceedings - 8th IEEE Workshop on Signal Propagation on Interconnects |
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Abstract
The influence of the ground line position on the signal shape in the time domain is investigated in the presence of grounded substrates [1, 2] with different conductivities of 10 S/m (low) and 100 S/m (medium). It is shown that the impact of substrate effects on time domain signals depends on the substrate conductivity, on the relative position of the ground line with respect to the signal lines as well as on the length of the line system. In addition, the impact of process-related generated voids between closely spaced signal lines on crosstalk is investigated, too.
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Proceedings - 8th IEEE Workshop on Signal Propagation on Interconnects. 2004. S. 85-88 (Proceedings - 8th IEEE Workshop on Signal Propagation on Interconnects).
Publikation: Beitrag in Buch/Bericht/Sammelwerk/Konferenzband › Aufsatz in Konferenzband › Forschung › Peer-Review
}
TY - GEN
T1 - Crosstalk in product related bus systems using 110 nm CMOS technology
AU - Ktata, M. Faïez
AU - Grabinski, Hartmut
AU - Arz, Uwe
AU - Fischer, Helmut
PY - 2004
Y1 - 2004
N2 - The influence of the ground line position on the signal shape in the time domain is investigated in the presence of grounded substrates [1, 2] with different conductivities of 10 S/m (low) and 100 S/m (medium). It is shown that the impact of substrate effects on time domain signals depends on the substrate conductivity, on the relative position of the ground line with respect to the signal lines as well as on the length of the line system. In addition, the impact of process-related generated voids between closely spaced signal lines on crosstalk is investigated, too.
AB - The influence of the ground line position on the signal shape in the time domain is investigated in the presence of grounded substrates [1, 2] with different conductivities of 10 S/m (low) and 100 S/m (medium). It is shown that the impact of substrate effects on time domain signals depends on the substrate conductivity, on the relative position of the ground line with respect to the signal lines as well as on the length of the line system. In addition, the impact of process-related generated voids between closely spaced signal lines on crosstalk is investigated, too.
UR - http://www.scopus.com/inward/record.url?scp=10044298514&partnerID=8YFLogxK
U2 - 10.1109/SPI.2004.1409012
DO - 10.1109/SPI.2004.1409012
M3 - Conference contribution
AN - SCOPUS:10044298514
SN - 0780384709
T3 - Proceedings - 8th IEEE Workshop on Signal Propagation on Interconnects
SP - 85
EP - 88
BT - Proceedings - 8th IEEE Workshop on Signal Propagation on Interconnects
T2 - 8th IEEE Workshop on Signal Propagation on Interconnects
Y2 - 9 May 2004 through 12 May 2004
ER -