Details
| Originalsprache | Englisch |
|---|---|
| Titel des Sammelwerks | 2005 International Symposium on Electromagnetic Compatibility |
| Untertitel | EMC |
| Seiten | 483-488 |
| Seitenumfang | 6 |
| Publikationsstatus | Veröffentlicht - 2005 |
| Veranstaltung | 2005 International Symposium on Electromagnetic Compatibility, EMC 2005 - Chicago, USA / Vereinigte Staaten Dauer: 8 Aug. 2005 → 12 Aug. 2005 |
Publikationsreihe
| Name | IEEE International Symposium on Electromagnetic Compatibility |
|---|---|
| Band | 2 |
| ISSN (Print) | 1077-4076 |
Abstract
In this paper the coupling of transient ultra wide band field pulses to complex electronic systems is determined. Different test setups of microcontroller circuits were used to investigate the coupling effects and to describe the injected interference parameters.
ASJC Scopus Sachgebiete
- Physik und Astronomie (insg.)
- Physik der kondensierten Materie
- Ingenieurwesen (insg.)
- Elektrotechnik und Elektronik
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- BibTex
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2005 International Symposium on Electromagnetic Compatibility: EMC. 2005. S. 483-488 1513563 (IEEE International Symposium on Electromagnetic Compatibility; Band 2).
Publikation: Beitrag in Buch/Bericht/Sammelwerk/Konferenzband › Aufsatz in Konferenzband › Forschung › Peer-Review
}
TY - GEN
T1 - Coupling of Transient Ultra Wide Band Electromagnetic Fields to Complex Electronic Systems
AU - Camp, M.
AU - Garbe, H.
AU - Sabath, F.
PY - 2005
Y1 - 2005
N2 - In this paper the coupling of transient ultra wide band field pulses to complex electronic systems is determined. Different test setups of microcontroller circuits were used to investigate the coupling effects and to describe the injected interference parameters.
AB - In this paper the coupling of transient ultra wide band field pulses to complex electronic systems is determined. Different test setups of microcontroller circuits were used to investigate the coupling effects and to describe the injected interference parameters.
KW - Coupling
KW - Electronic
KW - EMP
KW - Intereference
KW - UWB
UR - http://www.scopus.com/inward/record.url?scp=33746625206&partnerID=8YFLogxK
U2 - 10.1109/ISEMC.2005.1513563
DO - 10.1109/ISEMC.2005.1513563
M3 - Conference contribution
AN - SCOPUS:33746625206
SN - 0780393805
SN - 9780780393806
T3 - IEEE International Symposium on Electromagnetic Compatibility
SP - 483
EP - 488
BT - 2005 International Symposium on Electromagnetic Compatibility
T2 - 2005 International Symposium on Electromagnetic Compatibility, EMC 2005
Y2 - 8 August 2005 through 12 August 2005
ER -