Corrosion study on BGA assemblies

Publikation: Beitrag in Buch/Bericht/Sammelwerk/KonferenzbandAufsatz in KonferenzbandForschungPeer-Review

Autorschaft

Externe Organisationen

  • Universite de Bordeaux
Forschungs-netzwerk anzeigen

Details

OriginalspracheEnglisch
Titel des Sammelwerks2016 Pan Pacific Microelectronics Symposium, Pan Pacific 2016
Herausgeber (Verlag)Institute of Electrical and Electronics Engineers Inc.
ISBN (elektronisch)9780988887398
PublikationsstatusVeröffentlicht - 7 März 2016
VeranstaltungPan Pacific Microelectronics Symposium, Pan Pacific 2016 - Big Island, USA / Vereinigte Staaten
Dauer: 25 Jan. 201628 Jan. 2016

Abstract

For some applications like ship, aircraft and car, electronic systems are submitted to salt environment. In this case, the main reliability issue is the corrosion of the metals from the pads and the solder alloys. More than 20% of failures in microelectronic devices can be attributed to corrosion. Nevertheless this phenomenon is little studied on microelectronic assemblies. This paper presents ageing tests in salt spray chamber performed on BGA (Ball Grid Array) assemblies. The test vehicle is composed of BGA components with SnAgCu ball mounted on FR4 board. This BGA is a daisy chained component. So the electrical continuity of the assembly can be tested thanks to the electrical resistance measurement of the solder joint chain. The assemblies are put in a salt spray chamber at 35°C with 5% sodium chloride (NaCl) aqua according to the ASTM B117-09 standard, which is an accelerated test to stimulate the effects of a severe marine atmosphere on exposed surfaces. The assemblies are removed at 24, 48, 72 and 96 hours. The electrical resistance and the weight are measured during the test. The solder joints and the copper pads are observed and analysed with optical microscope. Then samples are cross-sectioned and polished to reveal the solder microstructure, in order to be examined by a scanning electron microscope (SEM) equipped with an energy-dispersive x-ray (EDX) system. The corrosion of some Cu pads is observed, in particular for the pads without solder alloy. The solder joint deterioration is visible but no electrical failure is detected. The microstructure is observed in order to determine the corroded residues found on the surface solder balls after the salt spray test. The Ag3Sn contained in SnAgCu solder joints seems to accelerate the corrosion of tin because of the galvanic corrosion mechanism.

ASJC Scopus Sachgebiete

Ziele für nachhaltige Entwicklung

Zitieren

Corrosion study on BGA assemblies. / Guedon-Gracia, A.; Fremont, H.; Deletage, J. Y. et al.
2016 Pan Pacific Microelectronics Symposium, Pan Pacific 2016. Institute of Electrical and Electronics Engineers Inc., 2016. 7428402.

Publikation: Beitrag in Buch/Bericht/Sammelwerk/KonferenzbandAufsatz in KonferenzbandForschungPeer-Review

Guedon-Gracia, A, Fremont, H, Deletage, JY & Weide-Zaage, K 2016, Corrosion study on BGA assemblies. in 2016 Pan Pacific Microelectronics Symposium, Pan Pacific 2016., 7428402, Institute of Electrical and Electronics Engineers Inc., Pan Pacific Microelectronics Symposium, Pan Pacific 2016, Big Island, USA / Vereinigte Staaten, 25 Jan. 2016. https://doi.org/10.1109/panpacific.2016.7428402
Guedon-Gracia, A., Fremont, H., Deletage, J. Y., & Weide-Zaage, K. (2016). Corrosion study on BGA assemblies. In 2016 Pan Pacific Microelectronics Symposium, Pan Pacific 2016 Artikel 7428402 Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/panpacific.2016.7428402
Guedon-Gracia A, Fremont H, Deletage JY, Weide-Zaage K. Corrosion study on BGA assemblies. in 2016 Pan Pacific Microelectronics Symposium, Pan Pacific 2016. Institute of Electrical and Electronics Engineers Inc. 2016. 7428402 doi: 10.1109/panpacific.2016.7428402
Guedon-Gracia, A. ; Fremont, H. ; Deletage, J. Y. et al. / Corrosion study on BGA assemblies. 2016 Pan Pacific Microelectronics Symposium, Pan Pacific 2016. Institute of Electrical and Electronics Engineers Inc., 2016.
Download
@inproceedings{cf6b1fad85ae4c09b67930c288fad032,
title = "Corrosion study on BGA assemblies",
abstract = "For some applications like ship, aircraft and car, electronic systems are submitted to salt environment. In this case, the main reliability issue is the corrosion of the metals from the pads and the solder alloys. More than 20% of failures in microelectronic devices can be attributed to corrosion. Nevertheless this phenomenon is little studied on microelectronic assemblies. This paper presents ageing tests in salt spray chamber performed on BGA (Ball Grid Array) assemblies. The test vehicle is composed of BGA components with SnAgCu ball mounted on FR4 board. This BGA is a daisy chained component. So the electrical continuity of the assembly can be tested thanks to the electrical resistance measurement of the solder joint chain. The assemblies are put in a salt spray chamber at 35°C with 5% sodium chloride (NaCl) aqua according to the ASTM B117-09 standard, which is an accelerated test to stimulate the effects of a severe marine atmosphere on exposed surfaces. The assemblies are removed at 24, 48, 72 and 96 hours. The electrical resistance and the weight are measured during the test. The solder joints and the copper pads are observed and analysed with optical microscope. Then samples are cross-sectioned and polished to reveal the solder microstructure, in order to be examined by a scanning electron microscope (SEM) equipped with an energy-dispersive x-ray (EDX) system. The corrosion of some Cu pads is observed, in particular for the pads without solder alloy. The solder joint deterioration is visible but no electrical failure is detected. The microstructure is observed in order to determine the corroded residues found on the surface solder balls after the salt spray test. The Ag3Sn contained in SnAgCu solder joints seems to accelerate the corrosion of tin because of the galvanic corrosion mechanism.",
keywords = "BGA assembly, corrosion, lead-free solder, salt spray test",
author = "A. Guedon-Gracia and H. Fremont and Deletage, {J. Y.} and K. Weide-Zaage",
note = "Publisher Copyright: {\textcopyright} 2016 SMTA. Copyright: Copyright 2017 Elsevier B.V., All rights reserved.; Pan Pacific Microelectronics Symposium, Pan Pacific 2016 ; Conference date: 25-01-2016 Through 28-01-2016",
year = "2016",
month = mar,
day = "7",
doi = "10.1109/panpacific.2016.7428402",
language = "English",
booktitle = "2016 Pan Pacific Microelectronics Symposium, Pan Pacific 2016",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
address = "United States",

}

Download

TY - GEN

T1 - Corrosion study on BGA assemblies

AU - Guedon-Gracia, A.

AU - Fremont, H.

AU - Deletage, J. Y.

AU - Weide-Zaage, K.

N1 - Publisher Copyright: © 2016 SMTA. Copyright: Copyright 2017 Elsevier B.V., All rights reserved.

PY - 2016/3/7

Y1 - 2016/3/7

N2 - For some applications like ship, aircraft and car, electronic systems are submitted to salt environment. In this case, the main reliability issue is the corrosion of the metals from the pads and the solder alloys. More than 20% of failures in microelectronic devices can be attributed to corrosion. Nevertheless this phenomenon is little studied on microelectronic assemblies. This paper presents ageing tests in salt spray chamber performed on BGA (Ball Grid Array) assemblies. The test vehicle is composed of BGA components with SnAgCu ball mounted on FR4 board. This BGA is a daisy chained component. So the electrical continuity of the assembly can be tested thanks to the electrical resistance measurement of the solder joint chain. The assemblies are put in a salt spray chamber at 35°C with 5% sodium chloride (NaCl) aqua according to the ASTM B117-09 standard, which is an accelerated test to stimulate the effects of a severe marine atmosphere on exposed surfaces. The assemblies are removed at 24, 48, 72 and 96 hours. The electrical resistance and the weight are measured during the test. The solder joints and the copper pads are observed and analysed with optical microscope. Then samples are cross-sectioned and polished to reveal the solder microstructure, in order to be examined by a scanning electron microscope (SEM) equipped with an energy-dispersive x-ray (EDX) system. The corrosion of some Cu pads is observed, in particular for the pads without solder alloy. The solder joint deterioration is visible but no electrical failure is detected. The microstructure is observed in order to determine the corroded residues found on the surface solder balls after the salt spray test. The Ag3Sn contained in SnAgCu solder joints seems to accelerate the corrosion of tin because of the galvanic corrosion mechanism.

AB - For some applications like ship, aircraft and car, electronic systems are submitted to salt environment. In this case, the main reliability issue is the corrosion of the metals from the pads and the solder alloys. More than 20% of failures in microelectronic devices can be attributed to corrosion. Nevertheless this phenomenon is little studied on microelectronic assemblies. This paper presents ageing tests in salt spray chamber performed on BGA (Ball Grid Array) assemblies. The test vehicle is composed of BGA components with SnAgCu ball mounted on FR4 board. This BGA is a daisy chained component. So the electrical continuity of the assembly can be tested thanks to the electrical resistance measurement of the solder joint chain. The assemblies are put in a salt spray chamber at 35°C with 5% sodium chloride (NaCl) aqua according to the ASTM B117-09 standard, which is an accelerated test to stimulate the effects of a severe marine atmosphere on exposed surfaces. The assemblies are removed at 24, 48, 72 and 96 hours. The electrical resistance and the weight are measured during the test. The solder joints and the copper pads are observed and analysed with optical microscope. Then samples are cross-sectioned and polished to reveal the solder microstructure, in order to be examined by a scanning electron microscope (SEM) equipped with an energy-dispersive x-ray (EDX) system. The corrosion of some Cu pads is observed, in particular for the pads without solder alloy. The solder joint deterioration is visible but no electrical failure is detected. The microstructure is observed in order to determine the corroded residues found on the surface solder balls after the salt spray test. The Ag3Sn contained in SnAgCu solder joints seems to accelerate the corrosion of tin because of the galvanic corrosion mechanism.

KW - BGA assembly

KW - corrosion

KW - lead-free solder

KW - salt spray test

UR - http://www.scopus.com/inward/record.url?scp=84964988373&partnerID=8YFLogxK

U2 - 10.1109/panpacific.2016.7428402

DO - 10.1109/panpacific.2016.7428402

M3 - Conference contribution

AN - SCOPUS:84964988373

BT - 2016 Pan Pacific Microelectronics Symposium, Pan Pacific 2016

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - Pan Pacific Microelectronics Symposium, Pan Pacific 2016

Y2 - 25 January 2016 through 28 January 2016

ER -

Von denselben Autoren