Details
| Originalsprache | Englisch |
|---|---|
| Titel des Sammelwerks | 12th International Conference on Integrated Power Electronics Systems |
| Untertitel | CIPS 2022 |
| Seiten | 355-360 |
| Seitenumfang | 6 |
| Publikationsstatus | Veröffentlicht - 2022 |
| Veranstaltung | 12th International Conference on Integrated Power Electronics Systems, CIPS 2022 - Berlin, Deutschland Dauer: 15 März 2022 → 17 März 2022 |
Publikationsreihe
| Name | ETG-Fachbericht |
|---|---|
| Band | 165 |
| ISSN (Print) | 0341-3934 |
Abstract
To date, PV micro-inverters, typically powered by one PV module, have been external devices outside of the solar module. The integration of the micro-inverter results in several advantages such as simplification of the installation, an increase in modular flexibility, safety, efficiency and reliability as well as significant reduction in costs. However, the requirements for the integration of an inverter with high power density are demanding, especially the cooling of the power semiconductors and passive components is challenging due to the possible high ambient temperatures between the PV module and the roof surface. The objective of this paper is the simulation and measurement based verification of a combined molding and housing concept which is designed for the cooling and heat distribution of around 10 W power losses of a DC/DC converter.
ASJC Scopus Sachgebiete
- Ingenieurwesen (insg.)
- Elektrotechnik und Elektronik
- Energie (insg.)
- Energieanlagenbau und Kraftwerkstechnik
Zitieren
- Standard
- Harvard
- Apa
- Vancouver
- BibTex
- RIS
12th International Conference on Integrated Power Electronics Systems: CIPS 2022. 2022. S. 355-360 (ETG-Fachbericht; Band 165).
Publikation: Beitrag in Buch/Bericht/Sammelwerk/Konferenzband › Aufsatz in Konferenzband › Forschung
}
TY - GEN
T1 - Cooling Concept and Molding Packaging for PV Module Integrated Micro-Inverters
AU - Manthey, Tobias
AU - Ranft, Paul
AU - Friebe, Jens
N1 - Funding Information: Parts of this work were funded by the German Federal Ministry for Economic Affairs and Energy under Grant No. 03EE1057A (Voyager-PV) and also by the Ministry of Science and Culture of Lower Saxony and the Volkswagen Foundation. The authors are responsible for the content of this publication.
PY - 2022
Y1 - 2022
N2 - To date, PV micro-inverters, typically powered by one PV module, have been external devices outside of the solar module. The integration of the micro-inverter results in several advantages such as simplification of the installation, an increase in modular flexibility, safety, efficiency and reliability as well as significant reduction in costs. However, the requirements for the integration of an inverter with high power density are demanding, especially the cooling of the power semiconductors and passive components is challenging due to the possible high ambient temperatures between the PV module and the roof surface. The objective of this paper is the simulation and measurement based verification of a combined molding and housing concept which is designed for the cooling and heat distribution of around 10 W power losses of a DC/DC converter.
AB - To date, PV micro-inverters, typically powered by one PV module, have been external devices outside of the solar module. The integration of the micro-inverter results in several advantages such as simplification of the installation, an increase in modular flexibility, safety, efficiency and reliability as well as significant reduction in costs. However, the requirements for the integration of an inverter with high power density are demanding, especially the cooling of the power semiconductors and passive components is challenging due to the possible high ambient temperatures between the PV module and the roof surface. The objective of this paper is the simulation and measurement based verification of a combined molding and housing concept which is designed for the cooling and heat distribution of around 10 W power losses of a DC/DC converter.
UR - http://www.scopus.com/inward/record.url?scp=85136127718&partnerID=8YFLogxK
M3 - Conference contribution
AN - SCOPUS:85136127718
T3 - ETG-Fachbericht
SP - 355
EP - 360
BT - 12th International Conference on Integrated Power Electronics Systems
T2 - 12th International Conference on Integrated Power Electronics Systems, CIPS 2022
Y2 - 15 March 2022 through 17 March 2022
ER -