Comparison of time- and frequency domain measurement results for product related card and MCM transmission lines up to 65 GHz

Publikation: Beitrag in Buch/Bericht/Sammelwerk/Konferenzband › Aufsatz in Konferenzband › Forschung › Peer-Review

Autoren

  • Thomas Michael Winkel
  • A. Deutsch
  • George A. Katopis
  • G. V. Kopcsay
  • E. Klink
  • W. D. Dyckman
  • B. J. Chamberlin
  • H. Grabinski
  • C. W. Surovic
  • H. Liu
  • C. Baks

Organisationseinheiten

Externe Organisationen

  • IBM
Forschungs-netzwerk anzeigen

Details

OriginalspracheEnglisch
Titel des Sammelwerks14th Topical Meeting on Electrical Performance of Electronic Packaging 2005
Seiten21-24
Seitenumfang4
PublikationsstatusVeröffentlicht - 2005
Veranstaltung14th Topical Meeting on Electrical Performance of Electronic Packaging 2005 - Austin, TX, USA / Vereinigte Staaten
Dauer: 24 Okt. 2005 → 26 Okt. 2005

Publikationsreihe

NameIEEE Topical Meeting on Electrical Performance of Electronic Packaging
Band2005

Abstract

Transmission line models and material parameters are extracted from time and frequency domain measurements for product related low loss card and ceramic MCM test line structures up to 65GHz. All measured results are compared to results as obtained from field calculations showing the advantages and limitations of the different methods on product driven test vehicles.

ASJC Scopus Sachgebiete

Zitieren

Comparison of time- and frequency domain measurement results for product related card and MCM transmission lines up to 65 GHz. / Winkel, Thomas Michael; Deutsch, A.; Katopis, George A. et al.
14th Topical Meeting on Electrical Performance of Electronic Packaging 2005. 2005. S. 21-24 1563690 (IEEE Topical Meeting on Electrical Performance of Electronic Packaging; Band 2005).

Publikation: Beitrag in Buch/Bericht/Sammelwerk/Konferenzband › Aufsatz in Konferenzband › Forschung › Peer-Review

Winkel, TM, Deutsch, A, Katopis, GA, Kopcsay, GV, Klink, E, Dyckman, WD, Chamberlin, BJ, Grabinski, H, Surovic, CW, Liu, H & Baks, C 2005, Comparison of time- and frequency domain measurement results for product related card and MCM transmission lines up to 65 GHz. in 14th Topical Meeting on Electrical Performance of Electronic Packaging 2005., 1563690, IEEE Topical Meeting on Electrical Performance of Electronic Packaging, Bd. 2005, S. 21-24, 14th Topical Meeting on Electrical Performance of Electronic Packaging 2005, Austin, TX, USA / Vereinigte Staaten, 24 Okt. 2005. https://doi.org/10.1109/EPEP.2005.1563690
Winkel, T. M., Deutsch, A., Katopis, G. A., Kopcsay, G. V., Klink, E., Dyckman, W. D., Chamberlin, B. J., Grabinski, H., Surovic, C. W., Liu, H., & Baks, C. (2005). Comparison of time- and frequency domain measurement results for product related card and MCM transmission lines up to 65 GHz. In 14th Topical Meeting on Electrical Performance of Electronic Packaging 2005 (S. 21-24). Artikel 1563690 (IEEE Topical Meeting on Electrical Performance of Electronic Packaging; Band 2005). https://doi.org/10.1109/EPEP.2005.1563690
Winkel TM, Deutsch A, Katopis GA, Kopcsay GV, Klink E, Dyckman WD et al. Comparison of time- and frequency domain measurement results for product related card and MCM transmission lines up to 65 GHz. in 14th Topical Meeting on Electrical Performance of Electronic Packaging 2005. 2005. S. 21-24. 1563690. (IEEE Topical Meeting on Electrical Performance of Electronic Packaging). doi: 10.1109/EPEP.2005.1563690
Winkel, Thomas Michael ; Deutsch, A. ; Katopis, George A. et al. / Comparison of time- and frequency domain measurement results for product related card and MCM transmission lines up to 65 GHz. 14th Topical Meeting on Electrical Performance of Electronic Packaging 2005. 2005. S. 21-24 (IEEE Topical Meeting on Electrical Performance of Electronic Packaging).
Download
@inproceedings{787379d537124c89a05d428a6f1dbb07,
title = "Comparison of time- and frequency domain measurement results for product related card and MCM transmission lines up to 65 GHz",
abstract = "Transmission line models and material parameters are extracted from time and frequency domain measurements for product related low loss card and ceramic MCM test line structures up to 65GHz. All measured results are compared to results as obtained from field calculations showing the advantages and limitations of the different methods on product driven test vehicles.",
author = "Winkel, {Thomas Michael} and A. Deutsch and Katopis, {George A.} and Kopcsay, {G. V.} and E. Klink and Dyckman, {W. D.} and Chamberlin, {B. J.} and H. Grabinski and Surovic, {C. W.} and H. Liu and C. Baks",
year = "2005",
doi = "10.1109/EPEP.2005.1563690",
language = "English",
isbn = "0780392205",
series = "IEEE Topical Meeting on Electrical Performance of Electronic Packaging",
pages = "21--24",
booktitle = "14th Topical Meeting on Electrical Performance of Electronic Packaging 2005",
note = "14th Topical Meeting on Electrical Performance of Electronic Packaging 2005 ; Conference date: 24-10-2005 Through 26-10-2005",

}

Download

TY - GEN

T1 - Comparison of time- and frequency domain measurement results for product related card and MCM transmission lines up to 65 GHz

AU - Winkel, Thomas Michael

AU - Deutsch, A.

AU - Katopis, George A.

AU - Kopcsay, G. V.

AU - Klink, E.

AU - Dyckman, W. D.

AU - Chamberlin, B. J.

AU - Grabinski, H.

AU - Surovic, C. W.

AU - Liu, H.

AU - Baks, C.

PY - 2005

Y1 - 2005

N2 - Transmission line models and material parameters are extracted from time and frequency domain measurements for product related low loss card and ceramic MCM test line structures up to 65GHz. All measured results are compared to results as obtained from field calculations showing the advantages and limitations of the different methods on product driven test vehicles.

AB - Transmission line models and material parameters are extracted from time and frequency domain measurements for product related low loss card and ceramic MCM test line structures up to 65GHz. All measured results are compared to results as obtained from field calculations showing the advantages and limitations of the different methods on product driven test vehicles.

UR - http://www.scopus.com/inward/record.url?scp=33845912665&partnerID=8YFLogxK

U2 - 10.1109/EPEP.2005.1563690

DO - 10.1109/EPEP.2005.1563690

M3 - Conference contribution

AN - SCOPUS:33845912665

SN - 0780392205

SN - 9780780392205

T3 - IEEE Topical Meeting on Electrical Performance of Electronic Packaging

SP - 21

EP - 24

BT - 14th Topical Meeting on Electrical Performance of Electronic Packaging 2005

T2 - 14th Topical Meeting on Electrical Performance of Electronic Packaging 2005

Y2 - 24 October 2005 through 26 October 2005

ER -