Chip formation in machining metal bonded grinding layers

Publikation: Beitrag in Buch/Bericht/Sammelwerk/KonferenzbandAufsatz in KonferenzbandForschungPeer-Review

Autoren

  • Berend Denkena
  • Thilo Grove
  • Vino Suntharakumaran
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Details

OriginalspracheEnglisch
Titel des Sammelwerks6th CIRP Global Web Conference, CIRPe 2018
UntertitelEnvisaging the Future Manufacturing, Design, Technologies and Systems in Innovation Era
Herausgeber/-innenAlessandro Simeone, Paolo C. Priarone
Herausgeber (Verlag)Elsevier Science B.V.
Seiten55-60
Seitenumfang6
ISBN (elektronisch)9781510875692
PublikationsstatusVeröffentlicht - 24 Nov. 2018
Veranstaltung6th CIRP Global Web Conference, CIRPe 2018 -
Dauer: 23 Okt. 201825 Okt. 2018

Publikationsreihe

NameProcedia CIRP
Band78
ISSN (Print)2212-8271

Abstract

Gears demand increasingly high quality regarding acoustic emissions, surface roughness and lifetime. Therefore, grinding is often the last step in the process chain of gear manufacturing. Grinding wheel grain sizes of 30 micrometers lead to high surface quality and metal bonded CBN-grains allow a high wear resistance and profile stability of the grinding tool. Consequently, an increase of the material removal rates and thus productivity is possible without increasing the thermal load on the workpiece due to the grinding wheels' high thermal conductivity. However, the time and cost intensive dressing process in combination with the high profile requirements for gear grinding prevent the wide application of metal bonded tools for this application. This challenge can be solved using a new dressing approach with geometrically defined cutting edges. Metal bonded CBN-grinding layers have a structure similar to metal-matrix-composites, which can be machined by using the turning operation. The aim of this work is to verify the machinability of metal bonded CBN-grinding layers. In the present work, the chip formation for metal bonded grinding layers is presented.

ASJC Scopus Sachgebiete

Zitieren

Chip formation in machining metal bonded grinding layers. / Denkena, Berend; Grove, Thilo; Suntharakumaran, Vino.
6th CIRP Global Web Conference, CIRPe 2018: Envisaging the Future Manufacturing, Design, Technologies and Systems in Innovation Era. Hrsg. / Alessandro Simeone; Paolo C. Priarone. Elsevier Science B.V., 2018. S. 55-60 (Procedia CIRP; Band 78).

Publikation: Beitrag in Buch/Bericht/Sammelwerk/KonferenzbandAufsatz in KonferenzbandForschungPeer-Review

Denkena, B, Grove, T & Suntharakumaran, V 2018, Chip formation in machining metal bonded grinding layers. in A Simeone & PC Priarone (Hrsg.), 6th CIRP Global Web Conference, CIRPe 2018: Envisaging the Future Manufacturing, Design, Technologies and Systems in Innovation Era. Procedia CIRP, Bd. 78, Elsevier Science B.V., S. 55-60, 6th CIRP Global Web Conference, CIRPe 2018, 23 Okt. 2018. https://doi.org/10.1016/j.procir.2018.08.321
Denkena, B., Grove, T., & Suntharakumaran, V. (2018). Chip formation in machining metal bonded grinding layers. In A. Simeone, & P. C. Priarone (Hrsg.), 6th CIRP Global Web Conference, CIRPe 2018: Envisaging the Future Manufacturing, Design, Technologies and Systems in Innovation Era (S. 55-60). (Procedia CIRP; Band 78). Elsevier Science B.V.. https://doi.org/10.1016/j.procir.2018.08.321
Denkena B, Grove T, Suntharakumaran V. Chip formation in machining metal bonded grinding layers. in Simeone A, Priarone PC, Hrsg., 6th CIRP Global Web Conference, CIRPe 2018: Envisaging the Future Manufacturing, Design, Technologies and Systems in Innovation Era. Elsevier Science B.V. 2018. S. 55-60. (Procedia CIRP). doi: 10.1016/j.procir.2018.08.321
Denkena, Berend ; Grove, Thilo ; Suntharakumaran, Vino. / Chip formation in machining metal bonded grinding layers. 6th CIRP Global Web Conference, CIRPe 2018: Envisaging the Future Manufacturing, Design, Technologies and Systems in Innovation Era. Hrsg. / Alessandro Simeone ; Paolo C. Priarone. Elsevier Science B.V., 2018. S. 55-60 (Procedia CIRP).
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AU - Suntharakumaran, Vino

N1 - Funding information: The authors would like to thank the Federal Ministry for Economic Affairs and Energy (BMWi) Germany for their organizational and financial support within the project “Development of a novel tool - and dressing concept adjusted for profile grinding evolute toothing with metal bonded CBN-tools” with the funding number “KF2328126AT4”.

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N2 - Gears demand increasingly high quality regarding acoustic emissions, surface roughness and lifetime. Therefore, grinding is often the last step in the process chain of gear manufacturing. Grinding wheel grain sizes of 30 micrometers lead to high surface quality and metal bonded CBN-grains allow a high wear resistance and profile stability of the grinding tool. Consequently, an increase of the material removal rates and thus productivity is possible without increasing the thermal load on the workpiece due to the grinding wheels' high thermal conductivity. However, the time and cost intensive dressing process in combination with the high profile requirements for gear grinding prevent the wide application of metal bonded tools for this application. This challenge can be solved using a new dressing approach with geometrically defined cutting edges. Metal bonded CBN-grinding layers have a structure similar to metal-matrix-composites, which can be machined by using the turning operation. The aim of this work is to verify the machinability of metal bonded CBN-grinding layers. In the present work, the chip formation for metal bonded grinding layers is presented.

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