Details
| Originalsprache | Englisch |
|---|---|
| Seiten (von - bis) | 311-317 |
| Seitenumfang | 7 |
| Fachzeitschrift | Advanced Optical Technologies |
| Jahrgang | 6 |
| Ausgabenummer | 3-4 |
| Publikationsstatus | Veröffentlicht - 12 Apr. 2017 |
Abstract
Present-day thermode bond systems for the assembly of radio-frequency identification (RFID) chips are mechanically inflexible, difficult to control, and will not meet future manufacturing challenges sufficiently. Chip bonding, one of the key processes in the production of integrated circuits (ICs), has a high potential for optimization with respect to process duration and process flexibility. For this purpose, the technologies used, so far, are supposed to be replaced by a transmission laser-bonding process using low-melting eutectic alloys. In this study, successful bonding investigations of mock silicon chips and of RFID chips on flexible polymer substrates are presented using the low-melting eutectic alloy, 52In48Sn, and a laser with a wavelength of 2 μm.
ASJC Scopus Sachgebiete
- Werkstoffwissenschaften (insg.)
- Elektronische, optische und magnetische Materialien
- Physik und Astronomie (insg.)
- Atom- und Molekularphysik sowie Optik
- Physik und Astronomie (insg.)
- Instrumentierung
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in: Advanced Optical Technologies, Jahrgang 6, Nr. 3-4, 12.04.2017, S. 311-317.
Publikation: Beitrag in Fachzeitschrift › Artikel › Forschung › Peer-Review
}
TY - JOUR
T1 - Chip bonding of low-melting eutectic alloys by transmitted laser radiation
AU - Hoff, Christian
AU - Venkatesh, Arjun
AU - Schneider, Friedrich
AU - Hermsdorf, Jörg
AU - Bengsch, Sebastian
AU - Wurz, Marc C.
AU - Kaierle, Stefan
AU - Overmeyer, Ludger
PY - 2017/4/12
Y1 - 2017/4/12
N2 - Present-day thermode bond systems for the assembly of radio-frequency identification (RFID) chips are mechanically inflexible, difficult to control, and will not meet future manufacturing challenges sufficiently. Chip bonding, one of the key processes in the production of integrated circuits (ICs), has a high potential for optimization with respect to process duration and process flexibility. For this purpose, the technologies used, so far, are supposed to be replaced by a transmission laser-bonding process using low-melting eutectic alloys. In this study, successful bonding investigations of mock silicon chips and of RFID chips on flexible polymer substrates are presented using the low-melting eutectic alloy, 52In48Sn, and a laser with a wavelength of 2 μm.
AB - Present-day thermode bond systems for the assembly of radio-frequency identification (RFID) chips are mechanically inflexible, difficult to control, and will not meet future manufacturing challenges sufficiently. Chip bonding, one of the key processes in the production of integrated circuits (ICs), has a high potential for optimization with respect to process duration and process flexibility. For this purpose, the technologies used, so far, are supposed to be replaced by a transmission laser-bonding process using low-melting eutectic alloys. In this study, successful bonding investigations of mock silicon chips and of RFID chips on flexible polymer substrates are presented using the low-melting eutectic alloy, 52In48Sn, and a laser with a wavelength of 2 μm.
KW - chip bonding
KW - eutectic alloys
KW - polymer substrates
KW - transmission laser bonding
UR - http://www.scopus.com/inward/record.url?scp=85020519508&partnerID=8YFLogxK
U2 - 10.1515/aot-2017-0011
DO - 10.1515/aot-2017-0011
M3 - Article
AN - SCOPUS:85020519508
VL - 6
SP - 311
EP - 317
JO - Advanced Optical Technologies
JF - Advanced Optical Technologies
SN - 2192-8576
IS - 3-4
ER -