Details
| Originalsprache | Englisch |
|---|---|
| Titel des Sammelwerks | 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2013 |
| Publikationsstatus | Veröffentlicht - 2013 |
| Veranstaltung | 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2013 - Wroclaw, Polen Dauer: 14 Apr. 2013 → 17 Apr. 2013 |
Publikationsreihe
| Name | 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2013 |
|---|
Abstract
Highly robust metallizations in ICs for high temperature and high current applications are needed. Special thick metal layers often known as 'power metals' are added to achieve a higher current capability. But these metallizations suffer from reliability limitations as well. Therefore a new design for 'power metals' was created for a 0.35μm aluminium CMOS process. The reliability of a new power metal structure is investigated in this article. A determination of the thermal-electrical and thermo-mechanical behaviour is carried out by simulations.
ASJC Scopus Sachgebiete
- Ingenieurwesen (insg.)
- Elektrotechnik und Elektronik
- Mathematik (insg.)
- Modellierung und Simulation
Zitieren
- Standard
- Harvard
- Apa
- Vancouver
- BibTex
- RIS
2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2013. 2013. 6529907 (2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2013).
Publikation: Beitrag in Buch/Bericht/Sammelwerk/Konferenzband › Aufsatz in Konferenzband › Forschung › Peer-Review
}
TY - GEN
T1 - Characterization of a new designed octahedron slotted metal track by simulations
AU - Kludt, Jörg
AU - Weide-Zaage, K.
AU - Ackermann, M.
AU - Hein, V.
N1 - Copyright: Copyright 2013 Elsevier B.V., All rights reserved.
PY - 2013
Y1 - 2013
N2 - Highly robust metallizations in ICs for high temperature and high current applications are needed. Special thick metal layers often known as 'power metals' are added to achieve a higher current capability. But these metallizations suffer from reliability limitations as well. Therefore a new design for 'power metals' was created for a 0.35μm aluminium CMOS process. The reliability of a new power metal structure is investigated in this article. A determination of the thermal-electrical and thermo-mechanical behaviour is carried out by simulations.
AB - Highly robust metallizations in ICs for high temperature and high current applications are needed. Special thick metal layers often known as 'power metals' are added to achieve a higher current capability. But these metallizations suffer from reliability limitations as well. Therefore a new design for 'power metals' was created for a 0.35μm aluminium CMOS process. The reliability of a new power metal structure is investigated in this article. A determination of the thermal-electrical and thermo-mechanical behaviour is carried out by simulations.
UR - http://www.scopus.com/inward/record.url?scp=84881013457&partnerID=8YFLogxK
U2 - 10.1109/EuroSimE.2013.6529907
DO - 10.1109/EuroSimE.2013.6529907
M3 - Conference contribution
AN - SCOPUS:84881013457
SN - 9781467361385
T3 - 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2013
BT - 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2013
T2 - 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2013
Y2 - 14 April 2013 through 17 April 2013
ER -