Carrier recombination at silicon-silicon nitride interfaces fabricated by plasma-enhanced chemical vapor deposition

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  • Institut für Solarenergieforschung GmbH (ISFH)
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Details

OriginalspracheEnglisch
Seiten (von - bis)3626-3633
Seitenumfang8
FachzeitschriftJournal of applied physics
Jahrgang85
Ausgabenummer7
PublikationsstatusVeröffentlicht - 1 Apr. 1999
Extern publiziertJa

Abstract

Light-based microwave-detected photoconductance decay method (MW-PCD) measurements on plasma-enhanced chemical vapor deposited (PECVD) SiNx surface-passivated float-zone silicon wafers of different doping type and resistivities are used to determine the dependence of the effective surface recombination velocity Seff on the injection level Δn within the wafer. Capacitance-voltage (C-V) and deep-level transient spectroscopy (DLTS) measurements are performed to determine the insulator charge density Qf, the interface state density Dit(E), and the capture cross sections σn(E) and σp(E). To avoid problems with leakage currents and hysteresis effects with Si-rich SiNx films, these investigations are performed on stoichiometric SiNx films.

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Carrier recombination at silicon-silicon nitride interfaces fabricated by plasma-enhanced chemical vapor deposition. / Schmidt, Jan; Aberle, Armin G.
in: Journal of applied physics, Jahrgang 85, Nr. 7, 01.04.1999, S. 3626-3633.

Publikation: Beitrag in FachzeitschriftArtikelForschungPeer-Review

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AU - Aberle, Armin G.

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