Details
| Originalsprache | Englisch |
|---|---|
| Seiten (von - bis) | 375-381 |
| Seitenumfang | 7 |
| Fachzeitschrift | IEEE Transactions on Advanced Packaging |
| Jahrgang | 23 |
| Ausgabenummer | 3 |
| Publikationsstatus | Veröffentlicht - 2000 |
Abstract
In this work, we investigate the electrical performance of critical signal paths in IBM's S/390 MCM packages. We present lumped RLC-models suitable for standard circuit simulators like e.g. SPICE. The models are developed from finite element simulations of typical signal path segments. By comparing S-parameters from simulations of the models to two-port network analyzer measurements we validate the models in a frequency range up to 3 GHz.
ASJC Scopus Sachgebiete
- Ingenieurwesen (insg.)
- Elektrotechnik und Elektronik
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in: IEEE Transactions on Advanced Packaging, Jahrgang 23, Nr. 3, 2000, S. 375-381.
Publikation: Beitrag in Fachzeitschrift › Artikel › Forschung › Peer-Review
}
TY - JOUR
T1 - Broadband modeling and measurement of the signal behavior in S/390 MCM packages
AU - Ktata, Faïez M.
AU - Arz, Uwe
AU - Grabinski, Hartmut
PY - 2000
Y1 - 2000
N2 - In this work, we investigate the electrical performance of critical signal paths in IBM's S/390 MCM packages. We present lumped RLC-models suitable for standard circuit simulators like e.g. SPICE. The models are developed from finite element simulations of typical signal path segments. By comparing S-parameters from simulations of the models to two-port network analyzer measurements we validate the models in a frequency range up to 3 GHz.
AB - In this work, we investigate the electrical performance of critical signal paths in IBM's S/390 MCM packages. We present lumped RLC-models suitable for standard circuit simulators like e.g. SPICE. The models are developed from finite element simulations of typical signal path segments. By comparing S-parameters from simulations of the models to two-port network analyzer measurements we validate the models in a frequency range up to 3 GHz.
KW - Electronic packaging
KW - Finite element simulations
KW - Lumped equivalent circuits
KW - MCM
KW - Parameter extraction
KW - S-parameter measurement
UR - http://www.scopus.com/inward/record.url?scp=0034238861&partnerID=8YFLogxK
U2 - 10.1109/6040.861550
DO - 10.1109/6040.861550
M3 - Article
AN - SCOPUS:0034238861
VL - 23
SP - 375
EP - 381
JO - IEEE Transactions on Advanced Packaging
JF - IEEE Transactions on Advanced Packaging
SN - 1521-3323
IS - 3
ER -