Boron-controlled solid phase epitaxy of germanium on silicon: A new nonsegregating surfactant

Publikation: Beitrag in FachzeitschriftArtikelForschungPeer-Review

Autoren

  • J. Klatt
  • D. Krüger
  • E. Bugiel
  • H. J. Osten

Externe Organisationen

  • Leibniz-Institut für innovative Mikroelektronik (IHP)
Forschungs-netzwerk anzeigen

Details

OriginalspracheEnglisch
Seiten (von - bis)360-362
Seitenumfang3
FachzeitschriftApplied physics letters
Jahrgang64
Ausgabenummer3
PublikationsstatusVeröffentlicht - 17 Jan. 1994
Extern publiziertJa

Abstract

10-nm-thick germanium layers have been grown on Si(100) with boron as a surfactant with three different growth procedures, and investigated with reflection high-energy electron diffraction, transmission electron microscopy, and secondary ion mass spectroscopy. We obtained smooth and completely closed epitaxial germanium layers only by depositing the boron on top of the amorphous germanium layer followed by a post-annealing step. The surface energy anisotropy of the germanium will be affected by the presence of boron in this equilibrium process. The islanding observed in all other growth processes can be understood by taking into account that boron is a typical nonsegregating material in Ge below 600°C and a surfactant acts mainly due to its presence in the growing front.

ASJC Scopus Sachgebiete

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Boron-controlled solid phase epitaxy of germanium on silicon: A new nonsegregating surfactant. / Klatt, J.; Krüger, D.; Bugiel, E. et al.
in: Applied physics letters, Jahrgang 64, Nr. 3, 17.01.1994, S. 360-362.

Publikation: Beitrag in FachzeitschriftArtikelForschungPeer-Review

Klatt J, Krüger D, Bugiel E, Osten HJ. Boron-controlled solid phase epitaxy of germanium on silicon: A new nonsegregating surfactant. Applied physics letters. 1994 Jan 17;64(3):360-362. doi: 10.1063/1.111148
Klatt, J. ; Krüger, D. ; Bugiel, E. et al. / Boron-controlled solid phase epitaxy of germanium on silicon : A new nonsegregating surfactant. in: Applied physics letters. 1994 ; Jahrgang 64, Nr. 3. S. 360-362.
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