Details
| Originalsprache | Englisch |
|---|---|
| Seiten (von - bis) | 13-18 |
| Seitenumfang | 6 |
| Fachzeitschrift | Procedia CIRP |
| Jahrgang | 23 |
| Ausgabenummer | C |
| Publikationsstatus | Veröffentlicht - 29 Dez. 2014 |
| Veranstaltung | 5th CIRP Conference on Assembly Technologies and Systems, CATS 2014 - Dresden, Deutschland Dauer: 12 Mai 2014 → 14 Mai 2014 |
Abstract
Reactive multilayer systems (RMS) represent an innovative heat source for the establishment of solder joints. They offer fast bonding processes that introduce very little thermal input and internal stress on the bonded parts. The current application process of RMS is predominantly manual labor. There are a couple of challenges to be overcome to automate this process, a requirement for its introduction into industrial production. In this paper we evaluate the requirements for an automated joining process with RMS and devise a concept of a modular assembly system for different product structures. Furthermore we show our results in gently and reliably gripping and handling of RMS.
ASJC Scopus Sachgebiete
- Ingenieurwesen (insg.)
- Steuerungs- und Systemtechnik
- Ingenieurwesen (insg.)
- Wirtschaftsingenieurwesen und Fertigungstechnik
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in: Procedia CIRP, Jahrgang 23, Nr. C, 29.12.2014, S. 13-18.
Publikation: Beitrag in Fachzeitschrift › Konferenzaufsatz in Fachzeitschrift › Forschung › Peer-Review
}
TY - JOUR
T1 - Automation concepts and gripping solutions for bonding with reactive multilayer systems
AU - Heyn, Jakob
AU - Blumenthal, Philipp
AU - Hemken, G.
AU - Fiedler, S.
AU - Walz, C.
AU - Raatz, Annika
AU - Dröder, Klaus
PY - 2014/12/29
Y1 - 2014/12/29
N2 - Reactive multilayer systems (RMS) represent an innovative heat source for the establishment of solder joints. They offer fast bonding processes that introduce very little thermal input and internal stress on the bonded parts. The current application process of RMS is predominantly manual labor. There are a couple of challenges to be overcome to automate this process, a requirement for its introduction into industrial production. In this paper we evaluate the requirements for an automated joining process with RMS and devise a concept of a modular assembly system for different product structures. Furthermore we show our results in gently and reliably gripping and handling of RMS.
AB - Reactive multilayer systems (RMS) represent an innovative heat source for the establishment of solder joints. They offer fast bonding processes that introduce very little thermal input and internal stress on the bonded parts. The current application process of RMS is predominantly manual labor. There are a couple of challenges to be overcome to automate this process, a requirement for its introduction into industrial production. In this paper we evaluate the requirements for an automated joining process with RMS and devise a concept of a modular assembly system for different product structures. Furthermore we show our results in gently and reliably gripping and handling of RMS.
KW - Automated Assembly
KW - Automated bonding
KW - Gripping
KW - Handling
KW - Process Automation
KW - Reactive multilayer systems
UR - http://www.scopus.com/inward/record.url?scp=84922724719&partnerID=8YFLogxK
U2 - 10.1016/j.procir.2014.03.198
DO - 10.1016/j.procir.2014.03.198
M3 - Conference article
AN - SCOPUS:84922724719
VL - 23
SP - 13
EP - 18
JO - Procedia CIRP
JF - Procedia CIRP
SN - 2212-8271
IS - C
T2 - 5th CIRP Conference on Assembly Technologies and Systems, CATS 2014
Y2 - 12 May 2014 through 14 May 2014
ER -