Details
| Originalsprache | Englisch |
|---|---|
| Titel des Sammelwerks | 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) |
| Seiten | 889-897 |
| Seitenumfang | 9 |
| ISBN (elektronisch) | 978-1-6654-7943-1 |
| Publikationsstatus | Veröffentlicht - 2022 |
Publikationsreihe
| Name | Proceedings - Electronic Components and Technology Conference |
|---|---|
| Band | 2022-May |
| ISSN (Print) | 0569-5503 |
Abstract
With the ever increasing demand for miniaturization in microfabrication, three dimensional integration is considered the key for progress and reliable vertical interconnect accesses (vias) are crucial. Glass substrates are potent alternatives for silicon in 3-D technologies with their comparable characteristics, their advantage of inherent isolation, and low insertion losses. Through-Glass Vias (TGVs) are commonly metallized using PVD, CVD, or electroless deposition for a seed layer followed by the electrodeposition of copper. Inspired by molded interconnect devices (MID) technologies, the goal of this paper is a solely electroless TGV filling on the basis of three priming approaches: self-assembling monolayers of (3-mercap-topropyl) trimethoxysilane (MPTMS), a photocatalytic layer of titanium tetraisopropoxide (TTiP) and a sol-gel process. Priming with a TBuT solution proved to be particularly suitable. This coating has high-temperature resistance, good adhesion in the TGVs, and allows a solely electroless filling with a layer stack of NiCuNiAu and CuNiAu.
ASJC Scopus Sachgebiete
- Werkstoffwissenschaften (insg.)
- Elektronische, optische und magnetische Materialien
- Ingenieurwesen (insg.)
- Elektrotechnik und Elektronik
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- BibTex
- RIS
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC). 2022. S. 889-897 (Proceedings - Electronic Components and Technology Conference; Band 2022-May).
Publikation: Beitrag in Buch/Bericht/Sammelwerk/Konferenzband › Aufsatz in Konferenzband › Forschung › Peer-Review
}
TY - GEN
T1 - Approaches for a Solely Electroless Metallization of Through-Glass Vias
AU - Zawacka, Aleksandra Monika
AU - Prediger, Maren Susanne
AU - Kassner, Alexander
AU - Dencker, Folke Enno
AU - Wurz, Marc
N1 - Funding Information: The research presented was the content of the master thesis project of Aleksandra M. Zawacka, which serves as preliminary result for the subproject “miniaturized vacuum pumping technology for the use in compact sensor system” within the collaborative research project InnoVaQ. The project is funded by the German Federal Ministry of Education and Research (BMBF); funding string 13N15919.
PY - 2022
Y1 - 2022
N2 - With the ever increasing demand for miniaturization in microfabrication, three dimensional integration is considered the key for progress and reliable vertical interconnect accesses (vias) are crucial. Glass substrates are potent alternatives for silicon in 3-D technologies with their comparable characteristics, their advantage of inherent isolation, and low insertion losses. Through-Glass Vias (TGVs) are commonly metallized using PVD, CVD, or electroless deposition for a seed layer followed by the electrodeposition of copper. Inspired by molded interconnect devices (MID) technologies, the goal of this paper is a solely electroless TGV filling on the basis of three priming approaches: self-assembling monolayers of (3-mercap-topropyl) trimethoxysilane (MPTMS), a photocatalytic layer of titanium tetraisopropoxide (TTiP) and a sol-gel process. Priming with a TBuT solution proved to be particularly suitable. This coating has high-temperature resistance, good adhesion in the TGVs, and allows a solely electroless filling with a layer stack of NiCuNiAu and CuNiAu.
AB - With the ever increasing demand for miniaturization in microfabrication, three dimensional integration is considered the key for progress and reliable vertical interconnect accesses (vias) are crucial. Glass substrates are potent alternatives for silicon in 3-D technologies with their comparable characteristics, their advantage of inherent isolation, and low insertion losses. Through-Glass Vias (TGVs) are commonly metallized using PVD, CVD, or electroless deposition for a seed layer followed by the electrodeposition of copper. Inspired by molded interconnect devices (MID) technologies, the goal of this paper is a solely electroless TGV filling on the basis of three priming approaches: self-assembling monolayers of (3-mercap-topropyl) trimethoxysilane (MPTMS), a photocatalytic layer of titanium tetraisopropoxide (TTiP) and a sol-gel process. Priming with a TBuT solution proved to be particularly suitable. This coating has high-temperature resistance, good adhesion in the TGVs, and allows a solely electroless filling with a layer stack of NiCuNiAu and CuNiAu.
KW - MEMS
KW - MPTMS
KW - SAMs
KW - TBuT
KW - TGVs
KW - TTiP
KW - chemisorption
KW - electroless metallization
UR - http://www.scopus.com/inward/record.url?scp=85134646532&partnerID=8YFLogxK
U2 - 10.1109/ectc51906.2022.00145
DO - 10.1109/ectc51906.2022.00145
M3 - Conference contribution
SN - 978-1-6654-7944-8
T3 - Proceedings - Electronic Components and Technology Conference
SP - 889
EP - 897
BT - 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
ER -