Details
| Originalsprache | Englisch |
|---|---|
| Titel des Sammelwerks | 2014 Design, Automation & Test in Europe Conference & Exhibition (DATE) |
| Herausgeber (Verlag) | Institute of Electrical and Electronics Engineers Inc. |
| ISBN (Print) | 9783981537024 |
| Publikationsstatus | Veröffentlicht - 2014 |
| Veranstaltung | 17th Design, Automation and Test in Europe, DATE 2014 - Dresden, Deutschland Dauer: 24 März 2014 → 28 März 2014 |
Publikationsreihe
| Name | Proceedings -Design, Automation and Test in Europe, DATE |
|---|---|
| ISSN (Print) | 1530-1591 |
Abstract
Mission Profiles contain top-level stress information for the design of future systems. These profiles are refined and transformed to design constraints. We present methods to propagate the constraints between design domains like package and chip. We also introduce a cross-domain methodology for our corresponding constraint transformation system ConDUCT. The proposed methods are demonstrated on the basis of an automotive analog/mixed-signal application.
ASJC Scopus Sachgebiete
- Ingenieurwesen (insg.)
- Allgemeiner Maschinenbau
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2014 Design, Automation & Test in Europe Conference & Exhibition (DATE). Institute of Electrical and Electronics Engineers Inc., 2014. 6800280 (Proceedings -Design, Automation and Test in Europe, DATE).
Publikation: Beitrag in Buch/Bericht/Sammelwerk/Konferenzband › Aufsatz in Konferenzband › Forschung › Peer-Review
}
TY - GEN
T1 - Application of Mission Profiles to enable cross-domain constraint-driven design
AU - Katzschke, C.
AU - Sohn, M. P.
AU - Olbrich, M.
AU - Meyer Zu Bexten, V.
AU - Tristl, M.
AU - Barke, E.
PY - 2014
Y1 - 2014
N2 - Mission Profiles contain top-level stress information for the design of future systems. These profiles are refined and transformed to design constraints. We present methods to propagate the constraints between design domains like package and chip. We also introduce a cross-domain methodology for our corresponding constraint transformation system ConDUCT. The proposed methods are demonstrated on the basis of an automotive analog/mixed-signal application.
AB - Mission Profiles contain top-level stress information for the design of future systems. These profiles are refined and transformed to design constraints. We present methods to propagate the constraints between design domains like package and chip. We also introduce a cross-domain methodology for our corresponding constraint transformation system ConDUCT. The proposed methods are demonstrated on the basis of an automotive analog/mixed-signal application.
KW - constraint transformation
KW - constraints in integrated circuits
KW - cross-domain constraints
KW - Mission Profiles and constraints
UR - http://www.scopus.com/inward/record.url?scp=84903836818&partnerID=8YFLogxK
U2 - 10.7873/DATE2014.079
DO - 10.7873/DATE2014.079
M3 - Conference contribution
SN - 9783981537024
T3 - Proceedings -Design, Automation and Test in Europe, DATE
BT - 2014 Design, Automation & Test in Europe Conference & Exhibition (DATE)
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 17th Design, Automation and Test in Europe, DATE 2014
Y2 - 24 March 2014 through 28 March 2014
ER -