An Integrated Heated Testbench for Characterizing High Temperature ICs

Publikation: Beitrag in Buch/Bericht/Sammelwerk/KonferenzbandAufsatz in KonferenzbandForschung

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OriginalspracheDeutsch
Titel des SammelwerksICT.OPEN Proceedings 2017
Seitenumfang18
PublikationsstatusVeröffentlicht - 2017
VeranstaltungICT.OPEN 2017 - Amersfoort, Niederlande
Dauer: 21 März 201722 März 2017

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An Integrated Heated Testbench for Characterizing High Temperature ICs. / Webering, Fritz; Payá Vayá, Guillermo; Aditya, Evan et al.
ICT.OPEN Proceedings 2017. 2017.

Publikation: Beitrag in Buch/Bericht/Sammelwerk/KonferenzbandAufsatz in KonferenzbandForschung

Webering, F, Payá Vayá, G, Aditya, E, Dürre, JC & Blume, HC 2017, An Integrated Heated Testbench for Characterizing High Temperature ICs. in ICT.OPEN Proceedings 2017. ICT.OPEN 2017, Amersfoort, Niederlande, 21 März 2017. https://doi.org/10.15488/13694
Webering F, Payá Vayá G, Aditya E, Dürre JC, Blume HC. An Integrated Heated Testbench for Characterizing High Temperature ICs. in ICT.OPEN Proceedings 2017. 2017 doi: 10.15488/13694
Webering, Fritz ; Payá Vayá, Guillermo ; Aditya, Evan et al. / An Integrated Heated Testbench for Characterizing High Temperature ICs. ICT.OPEN Proceedings 2017. 2017.
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title = "An Integrated Heated Testbench for Characterizing High Temperature ICs",
author = "Fritz Webering and {Pay{\'a} Vay{\'a}}, Guillermo and Evan Aditya and D{\"u}rre, {Jan Christoph} and Blume, {Holger Christoph}",
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AU - Webering, Fritz

AU - Payá Vayá, Guillermo

AU - Aditya, Evan

AU - Dürre, Jan Christoph

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PY - 2017

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