Details
Originalsprache | Englisch |
---|---|
Titel des Sammelwerks | Proc. of the Adaptronic Congress 2008 |
Erscheinungsort | Berlin, Germany |
Seiten | 103-109 |
Seitenumfang | 7 |
Publikationsstatus | Veröffentlicht - Juni 2008 |
Zitieren
- Standard
- Harvard
- Apa
- Vancouver
- BibTex
- RIS
An Electromagnetically Actuated Punch for Cutting Micro-Components. / Dagen, M.; Heimann, Bodo.
Proc. of the Adaptronic Congress 2008. Berlin, Germany, 2008. S. 103-109.
Proc. of the Adaptronic Congress 2008. Berlin, Germany, 2008. S. 103-109.
Publikation: Beitrag in Buch/Bericht/Sammelwerk/Konferenzband › Aufsatz in Konferenzband › Forschung › Peer-Review
Dagen, M & Heimann, B 2008, An Electromagnetically Actuated Punch for Cutting Micro-Components. in Proc. of the Adaptronic Congress 2008. Berlin, Germany, S. 103-109.
Dagen, M., & Heimann, B. (2008). An Electromagnetically Actuated Punch for Cutting Micro-Components. In Proc. of the Adaptronic Congress 2008 (S. 103-109).
Dagen M, Heimann B. An Electromagnetically Actuated Punch for Cutting Micro-Components. in Proc. of the Adaptronic Congress 2008. Berlin, Germany. 2008. S. 103-109
Download
@inproceedings{3efbe1c331084a098ce916e7f5943f9a,
title = "An Electromagnetically Actuated Punch for Cutting Micro-Components",
author = "M. Dagen and Bodo Heimann",
year = "2008",
month = jun,
language = "English",
pages = "103--109",
booktitle = "Proc. of the Adaptronic Congress 2008",
}
Download
TY - GEN
T1 - An Electromagnetically Actuated Punch for Cutting Micro-Components
AU - Dagen, M.
AU - Heimann, Bodo
PY - 2008/6
Y1 - 2008/6
M3 - Conference contribution
SP - 103
EP - 109
BT - Proc. of the Adaptronic Congress 2008
CY - Berlin, Germany
ER -