An Electromagnetically Actuated Punch for Cutting Micro-Components

Publikation: Beitrag in Buch/Bericht/Sammelwerk/KonferenzbandAufsatz in KonferenzbandForschungPeer-Review

Autoren

  • M. Dagen
  • Bodo Heimann

Organisationseinheiten

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Details

OriginalspracheEnglisch
Titel des SammelwerksProc. of the Adaptronic Congress 2008
ErscheinungsortBerlin, Germany
Seiten103-109
Seitenumfang7
PublikationsstatusVeröffentlicht - Juni 2008

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An Electromagnetically Actuated Punch for Cutting Micro-Components. / Dagen, M.; Heimann, Bodo.
Proc. of the Adaptronic Congress 2008. Berlin, Germany, 2008. S. 103-109.

Publikation: Beitrag in Buch/Bericht/Sammelwerk/KonferenzbandAufsatz in KonferenzbandForschungPeer-Review

Dagen, M & Heimann, B 2008, An Electromagnetically Actuated Punch for Cutting Micro-Components. in Proc. of the Adaptronic Congress 2008. Berlin, Germany, S. 103-109.
Dagen, M., & Heimann, B. (2008). An Electromagnetically Actuated Punch for Cutting Micro-Components. In Proc. of the Adaptronic Congress 2008 (S. 103-109).
Dagen M, Heimann B. An Electromagnetically Actuated Punch for Cutting Micro-Components. in Proc. of the Adaptronic Congress 2008. Berlin, Germany. 2008. S. 103-109
Dagen, M. ; Heimann, Bodo. / An Electromagnetically Actuated Punch for Cutting Micro-Components. Proc. of the Adaptronic Congress 2008. Berlin, Germany, 2008. S. 103-109
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