Details
Originalsprache | Englisch |
---|---|
Aufsatznummer | 6264076 |
Seiten (von - bis) | 77-82 |
Seitenumfang | 6 |
Fachzeitschrift | IEEE journal of photovoltaics |
Jahrgang | 3 |
Ausgabenummer | 1 |
Publikationsstatus | Veröffentlicht - 9 Aug. 2012 |
Abstract
We demonstrate the interconnection of silicon solar cells with evaporated aluminum back contacts using an aluminum foil which is attached to a silicone encapsulant. The aluminum-based mechanical and electrical laser interconnection (AMELI) process forms laser weld spots using single laser pulses. These laser welds resist high mechanical stresses and have a low electrical contact resistivity. No solder, conductive adhesives, or Ag-pastes are required for interconnection. We find the electrical contact resistivity to be below ρ c = 0.01 mΩ·cm2. The contact resistance is constant under accelerated aging of 300 humidity-freeze cycles. With a tensile testing machine, we measure tear-off stresses in the perpendicular direction of up to 380 kPa for our laser weld spots. We present a proof-of-concept module which consists of five n-type back-junction back-contact solar cells with a conversion efficiency of 20.4%. The unchanged fill factor FF and open circuit voltage V\rm oc verify a damage-and loss-free interconnection which is supported by electroluminescence measurements.
ASJC Scopus Sachgebiete
- Werkstoffwissenschaften (insg.)
- Elektronische, optische und magnetische Materialien
- Physik und Astronomie (insg.)
- Physik der kondensierten Materie
- Ingenieurwesen (insg.)
- Elektrotechnik und Elektronik
Ziele für nachhaltige Entwicklung
Zitieren
- Standard
- Harvard
- Apa
- Vancouver
- BibTex
- RIS
in: IEEE journal of photovoltaics, Jahrgang 3, Nr. 1, 6264076, 09.08.2012, S. 77-82.
Publikation: Beitrag in Fachzeitschrift › Artikel › Forschung › Peer-Review
}
TY - JOUR
T1 - Al-Foil on Encapsulant for the Interconnection of Al-Metalized Silicon Solar Cells
AU - Schulte-Huxel, Henning
AU - Blankemeyer, Susanne
AU - Bock, Robert
AU - Merkle, Agnes
AU - Kajari-Schröder, Sarah
AU - Brendel, Rolf
PY - 2012/8/9
Y1 - 2012/8/9
N2 - We demonstrate the interconnection of silicon solar cells with evaporated aluminum back contacts using an aluminum foil which is attached to a silicone encapsulant. The aluminum-based mechanical and electrical laser interconnection (AMELI) process forms laser weld spots using single laser pulses. These laser welds resist high mechanical stresses and have a low electrical contact resistivity. No solder, conductive adhesives, or Ag-pastes are required for interconnection. We find the electrical contact resistivity to be below ρ c = 0.01 mΩ·cm2. The contact resistance is constant under accelerated aging of 300 humidity-freeze cycles. With a tensile testing machine, we measure tear-off stresses in the perpendicular direction of up to 380 kPa for our laser weld spots. We present a proof-of-concept module which consists of five n-type back-junction back-contact solar cells with a conversion efficiency of 20.4%. The unchanged fill factor FF and open circuit voltage V\rm oc verify a damage-and loss-free interconnection which is supported by electroluminescence measurements.
AB - We demonstrate the interconnection of silicon solar cells with evaporated aluminum back contacts using an aluminum foil which is attached to a silicone encapsulant. The aluminum-based mechanical and electrical laser interconnection (AMELI) process forms laser weld spots using single laser pulses. These laser welds resist high mechanical stresses and have a low electrical contact resistivity. No solder, conductive adhesives, or Ag-pastes are required for interconnection. We find the electrical contact resistivity to be below ρ c = 0.01 mΩ·cm2. The contact resistance is constant under accelerated aging of 300 humidity-freeze cycles. With a tensile testing machine, we measure tear-off stresses in the perpendicular direction of up to 380 kPa for our laser weld spots. We present a proof-of-concept module which consists of five n-type back-junction back-contact solar cells with a conversion efficiency of 20.4%. The unchanged fill factor FF and open circuit voltage V\rm oc verify a damage-and loss-free interconnection which is supported by electroluminescence measurements.
KW - Al-metallization
KW - back-contact solar cells
KW - laser microwelding
KW - lead-free
KW - module-level inter-connection
KW - photovoltaic module
UR - http://www.scopus.com/inward/record.url?scp=84871737750&partnerID=8YFLogxK
U2 - 10.1109/JPHOTOV.2012.2208096
DO - 10.1109/JPHOTOV.2012.2208096
M3 - Article
AN - SCOPUS:84871737750
VL - 3
SP - 77
EP - 82
JO - IEEE journal of photovoltaics
JF - IEEE journal of photovoltaics
SN - 2156-3381
IS - 1
M1 - 6264076
ER -