Details
| Originalsprache | Englisch |
|---|---|
| Titel des Sammelwerks | 2020 Pan Pacific Microelectronics Symposium, Pan Pacific 2020 |
| Herausgeber (Verlag) | Institute of Electrical and Electronics Engineers Inc. |
| ISBN (elektronisch) | 9781944543143 |
| ISBN (Print) | 978-1-7281-4584-6 |
| Publikationsstatus | Veröffentlicht - 2020 |
| Veranstaltung | 2020 Pan Pacific Microelectronics Symposium, Pan Pacific 2020 - Kohala Coast, USA / Vereinigte Staaten Dauer: 10 Feb. 2020 → 13 Feb. 2020 |
Abstract
A review about latest advances in packaging and drivers for the development of novel packaging technologies will be given in this paper. Starting with a description about the trends in miniaturization of IC packaging and the demand for heterogeneous integration in the following a focus on commonly applied processes like System-on-Chip, Flip-Chip packaging, Fan-out packaging and 3D-Integration will be presented. A brief explanation about process characteristics, followed by an explanation of the main process steps is described. The latest version of the heterogeneous integration roadmap is short introduced. The link to corresponding fields of application like high performance computing and AI processing, mobile electronics and 5G, and automotive is given. Here, main requirements for each technological sectors are worked out followed by a description of commonly applied package types. Each sector is round up by mentioning key challenges for future developments.
ASJC Scopus Sachgebiete
- Werkstoffwissenschaften (insg.)
- Elektronische, optische und magnetische Materialien
- Ingenieurwesen (insg.)
- Elektrotechnik und Elektronik
- Ingenieurwesen (insg.)
- Werkstoffmechanik
- Ingenieurwesen (insg.)
- Sicherheit, Risiko, Zuverlässigkeit und Qualität
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2020 Pan Pacific Microelectronics Symposium, Pan Pacific 2020. Institute of Electrical and Electronics Engineers Inc., 2020. 9059539.
Publikation: Beitrag in Buch/Bericht/Sammelwerk/Konferenzband › Aufsatz in Konferenzband › Forschung › Peer-Review
}
TY - GEN
T1 - Advances in Packaging for Emerging Technologies
AU - Hollstein, Kai
AU - Weide-Zaage, Kirsten
PY - 2020
Y1 - 2020
N2 - A review about latest advances in packaging and drivers for the development of novel packaging technologies will be given in this paper. Starting with a description about the trends in miniaturization of IC packaging and the demand for heterogeneous integration in the following a focus on commonly applied processes like System-on-Chip, Flip-Chip packaging, Fan-out packaging and 3D-Integration will be presented. A brief explanation about process characteristics, followed by an explanation of the main process steps is described. The latest version of the heterogeneous integration roadmap is short introduced. The link to corresponding fields of application like high performance computing and AI processing, mobile electronics and 5G, and automotive is given. Here, main requirements for each technological sectors are worked out followed by a description of commonly applied package types. Each sector is round up by mentioning key challenges for future developments.
AB - A review about latest advances in packaging and drivers for the development of novel packaging technologies will be given in this paper. Starting with a description about the trends in miniaturization of IC packaging and the demand for heterogeneous integration in the following a focus on commonly applied processes like System-on-Chip, Flip-Chip packaging, Fan-out packaging and 3D-Integration will be presented. A brief explanation about process characteristics, followed by an explanation of the main process steps is described. The latest version of the heterogeneous integration roadmap is short introduced. The link to corresponding fields of application like high performance computing and AI processing, mobile electronics and 5G, and automotive is given. Here, main requirements for each technological sectors are worked out followed by a description of commonly applied package types. Each sector is round up by mentioning key challenges for future developments.
KW - 5G
KW - Advanced packaging
KW - AI
KW - automotive
KW - future technologies
UR - http://www.scopus.com/inward/record.url?scp=85084177973&partnerID=8YFLogxK
U2 - 10.23919/panpacific48324.2020.9059539
DO - 10.23919/panpacific48324.2020.9059539
M3 - Conference contribution
AN - SCOPUS:85084177973
SN - 978-1-7281-4584-6
BT - 2020 Pan Pacific Microelectronics Symposium, Pan Pacific 2020
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2020 Pan Pacific Microelectronics Symposium, Pan Pacific 2020
Y2 - 10 February 2020 through 13 February 2020
ER -