Details
Originalsprache | Englisch |
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Titel des Sammelwerks | Precision Assembly Technologies and Systems - 6th IFIP WG 5.5 International Precision Assembly Seminar, IPAS 2012, Proceedings |
Seiten | 73-80 |
Seitenumfang | 8 |
Publikationsstatus | Veröffentlicht - 18 Mai 2012 |
Extern publiziert | Ja |
Veranstaltung | 6th International Precision Assembly Seminar, IPAS 2012 - Chamonix, Frankreich Dauer: 12 Feb. 2012 → 15 Feb. 2012 |
Publikationsreihe
Name | IFIP Advances in Information and Communication Technology |
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Band | 371 AICT |
ISSN (Print) | 1868-4238 |
Abstract
Even though significant progress has been made in the field of micro production and the development of miniaturized micro production-machines in the last ten years, an explicit consideration of clamping-devices has not taken place. The requirements for clamping technology in the manufacturing of microparts and the manufacturing of macroscale parts are highly different. Special clamping devices for each sector are needed. This article presents the designing of a special adhesive micro-clamping device for micro production. The clamping force is applied by fixing the workpiece to the clamping module using hot melt adhesives. Thus high surface pressure and damage to the micro-component is avoided. The development of this adhesive clamping device is a first implementation of a novel and promising approach for micro production. Basic functioning could be confirmed by practical tests.
ASJC Scopus Sachgebiete
- Informatik (insg.)
- Information systems
- Informatik (insg.)
- Computernetzwerke und -kommunikation
- Entscheidungswissenschaften (insg.)
- Informationssysteme und -management
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- BibTex
- RIS
Precision Assembly Technologies and Systems - 6th IFIP WG 5.5 International Precision Assembly Seminar, IPAS 2012, Proceedings. 2012. S. 73-80 (IFIP Advances in Information and Communication Technology; Band 371 AICT).
Publikation: Beitrag in Buch/Bericht/Sammelwerk/Konferenzband › Aufsatz in Konferenzband › Forschung › Peer-Review
}
TY - GEN
T1 - Adhesive workpiece fixturing for micromachining
AU - Blumenthal, Philipp
AU - Raatz, Annika
PY - 2012/5/18
Y1 - 2012/5/18
N2 - Even though significant progress has been made in the field of micro production and the development of miniaturized micro production-machines in the last ten years, an explicit consideration of clamping-devices has not taken place. The requirements for clamping technology in the manufacturing of microparts and the manufacturing of macroscale parts are highly different. Special clamping devices for each sector are needed. This article presents the designing of a special adhesive micro-clamping device for micro production. The clamping force is applied by fixing the workpiece to the clamping module using hot melt adhesives. Thus high surface pressure and damage to the micro-component is avoided. The development of this adhesive clamping device is a first implementation of a novel and promising approach for micro production. Basic functioning could be confirmed by practical tests.
AB - Even though significant progress has been made in the field of micro production and the development of miniaturized micro production-machines in the last ten years, an explicit consideration of clamping-devices has not taken place. The requirements for clamping technology in the manufacturing of microparts and the manufacturing of macroscale parts are highly different. Special clamping devices for each sector are needed. This article presents the designing of a special adhesive micro-clamping device for micro production. The clamping force is applied by fixing the workpiece to the clamping module using hot melt adhesives. Thus high surface pressure and damage to the micro-component is avoided. The development of this adhesive clamping device is a first implementation of a novel and promising approach for micro production. Basic functioning could be confirmed by practical tests.
KW - Adhesive
KW - Clamping
KW - Fixturing
KW - Hot Melts
KW - Micromachinig
UR - http://www.scopus.com/inward/record.url?scp=84860997612&partnerID=8YFLogxK
U2 - 10.1007/978-3-642-28163-1_10
DO - 10.1007/978-3-642-28163-1_10
M3 - Conference contribution
AN - SCOPUS:84860997612
SN - 9783642281624
T3 - IFIP Advances in Information and Communication Technology
SP - 73
EP - 80
BT - Precision Assembly Technologies and Systems - 6th IFIP WG 5.5 International Precision Assembly Seminar, IPAS 2012, Proceedings
T2 - 6th International Precision Assembly Seminar, IPAS 2012
Y2 - 12 February 2012 through 15 February 2012
ER -