Details
Originalsprache | Englisch |
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Titel des Sammelwerks | 56th ARFTG Conference Digest |
Untertitel | Metrology and Test for RF Telecommunications, ARFTG 2000 |
Herausgeber (Verlag) | Institute of Electrical and Electronics Engineers Inc. |
ISBN (elektronisch) | 0780356861, 9780780356863 |
Publikationsstatus | Veröffentlicht - 2000 |
Veranstaltung | 56th ARFTG Conference Digest, ARFTG 2000 - Boulder, USA / Vereinigte Staaten Dauer: 30 Nov. 2000 → 1 Dez. 2000 |
Publikationsreihe
Name | 56th ARFTG Conference Digest: Metrology and Test for RF Telecommunications, ARFTG 2000 |
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Abstract
The electrical scattering field at steps on interconnects can be taken into account by a virtual additional line length of the wider line [1]. This effect must be taken into account when characterizing on and off-chip interconnects with discontinuities. The theory will be discussed and measurement results will be presented.
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- RIS
56th ARFTG Conference Digest: Metrology and Test for RF Telecommunications, ARFTG 2000. Institute of Electrical and Electronics Engineers Inc., 2000. 4120144 (56th ARFTG Conference Digest: Metrology and Test for RF Telecommunications, ARFTG 2000).
Publikation: Beitrag in Buch/Bericht/Sammelwerk/Konferenzband › Aufsatz in Konferenzband › Forschung › Peer-Review
}
TY - GEN
T1 - Accurate Characterization of Fringing Effects at On-Chip Line Steps
AU - Winkel, Thomas Michael
AU - Dutta, Lohit Sagar
AU - Grabinski, Hartmut
PY - 2000
Y1 - 2000
N2 - The electrical scattering field at steps on interconnects can be taken into account by a virtual additional line length of the wider line [1]. This effect must be taken into account when characterizing on and off-chip interconnects with discontinuities. The theory will be discussed and measurement results will be presented.
AB - The electrical scattering field at steps on interconnects can be taken into account by a virtual additional line length of the wider line [1]. This effect must be taken into account when characterizing on and off-chip interconnects with discontinuities. The theory will be discussed and measurement results will be presented.
UR - http://www.scopus.com/inward/record.url?scp=84960406267&partnerID=8YFLogxK
U2 - 10.1109/ARFTG.2000.327445
DO - 10.1109/ARFTG.2000.327445
M3 - Conference contribution
AN - SCOPUS:84960406267
T3 - 56th ARFTG Conference Digest: Metrology and Test for RF Telecommunications, ARFTG 2000
BT - 56th ARFTG Conference Digest
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 56th ARFTG Conference Digest, ARFTG 2000
Y2 - 30 November 2000 through 1 December 2000
ER -