Accurate Characterization of Fringing Effects at On-Chip Line Steps

Publikation: Beitrag in Buch/Bericht/Sammelwerk/KonferenzbandAufsatz in KonferenzbandForschungPeer-Review

Autoren

  • Thomas Michael Winkel
  • Lohit Sagar Dutta
  • Hartmut Grabinski

Externe Organisationen

  • IBM
Forschungs-netzwerk anzeigen

Details

OriginalspracheEnglisch
Titel des Sammelwerks56th ARFTG Conference Digest
UntertitelMetrology and Test for RF Telecommunications, ARFTG 2000
Herausgeber (Verlag)Institute of Electrical and Electronics Engineers Inc.
ISBN (elektronisch)0780356861, 9780780356863
PublikationsstatusVeröffentlicht - 2000
Veranstaltung56th ARFTG Conference Digest, ARFTG 2000 - Boulder, USA / Vereinigte Staaten
Dauer: 30 Nov. 20001 Dez. 2000

Publikationsreihe

Name56th ARFTG Conference Digest: Metrology and Test for RF Telecommunications, ARFTG 2000

Abstract

The electrical scattering field at steps on interconnects can be taken into account by a virtual additional line length of the wider line [1]. This effect must be taken into account when characterizing on and off-chip interconnects with discontinuities. The theory will be discussed and measurement results will be presented.

ASJC Scopus Sachgebiete

Zitieren

Accurate Characterization of Fringing Effects at On-Chip Line Steps. / Winkel, Thomas Michael; Dutta, Lohit Sagar; Grabinski, Hartmut.
56th ARFTG Conference Digest: Metrology and Test for RF Telecommunications, ARFTG 2000. Institute of Electrical and Electronics Engineers Inc., 2000. 4120144 (56th ARFTG Conference Digest: Metrology and Test for RF Telecommunications, ARFTG 2000).

Publikation: Beitrag in Buch/Bericht/Sammelwerk/KonferenzbandAufsatz in KonferenzbandForschungPeer-Review

Winkel, TM, Dutta, LS & Grabinski, H 2000, Accurate Characterization of Fringing Effects at On-Chip Line Steps. in 56th ARFTG Conference Digest: Metrology and Test for RF Telecommunications, ARFTG 2000., 4120144, 56th ARFTG Conference Digest: Metrology and Test for RF Telecommunications, ARFTG 2000, Institute of Electrical and Electronics Engineers Inc., 56th ARFTG Conference Digest, ARFTG 2000, Boulder, USA / Vereinigte Staaten, 30 Nov. 2000. https://doi.org/10.1109/ARFTG.2000.327445
Winkel, T. M., Dutta, L. S., & Grabinski, H. (2000). Accurate Characterization of Fringing Effects at On-Chip Line Steps. In 56th ARFTG Conference Digest: Metrology and Test for RF Telecommunications, ARFTG 2000 Artikel 4120144 (56th ARFTG Conference Digest: Metrology and Test for RF Telecommunications, ARFTG 2000). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ARFTG.2000.327445
Winkel TM, Dutta LS, Grabinski H. Accurate Characterization of Fringing Effects at On-Chip Line Steps. in 56th ARFTG Conference Digest: Metrology and Test for RF Telecommunications, ARFTG 2000. Institute of Electrical and Electronics Engineers Inc. 2000. 4120144. (56th ARFTG Conference Digest: Metrology and Test for RF Telecommunications, ARFTG 2000). doi: 10.1109/ARFTG.2000.327445
Winkel, Thomas Michael ; Dutta, Lohit Sagar ; Grabinski, Hartmut. / Accurate Characterization of Fringing Effects at On-Chip Line Steps. 56th ARFTG Conference Digest: Metrology and Test for RF Telecommunications, ARFTG 2000. Institute of Electrical and Electronics Engineers Inc., 2000. (56th ARFTG Conference Digest: Metrology and Test for RF Telecommunications, ARFTG 2000).
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