Details
| Originalsprache | Englisch |
|---|---|
| Titel des Sammelwerks | 17th IEEE International Conference on Micro Electro Mechanical Systems (MEMS) |
| Untertitel | Maastricht MEMS 2004 Technical Digest |
| Seiten | 462-465 |
| Seitenumfang | 4 |
| Publikationsstatus | Veröffentlicht - 27 Sept. 2004 |
| Extern publiziert | Ja |
| Veranstaltung | 17th IEEE International Conference on Micro Electro Mechanical Systems: MEMS 2004 Technical Digest - Maastricht, Niederlande Dauer: 25 Jan. 2004 → 29 Jan. 2004 Konferenznummer: 17 https://library.villanova.edu/Find/Record/1476111/Details |
Abstract
The micropump presented in this paper demonstrates advancements made both in performance and fabrication over most existing mechanical micropumps. The pump is planar and fabricated using a wafer-level, four-mask process, making it attractive for integration into micro total-analysis systems. Its design utilizes thermopneumatic actuation and two in-plane flap valves with fluidic-resistance ratios greater than 1300 to reach maximum pressures of 16 kPa and maximum flow rates of 9 μL/min at an average power consumption of 180 mW (20% duty cycle, 10 Hz). Pressures as high as 20.2 kPa were achieved at an average power consumption of 200 mW (20% duty cycle, 5 Hz). This performance is better than most micropumps utilizing in-plane or out-of-plane valves.
ASJC Scopus Sachgebiete
- Werkstoffwissenschaften (insg.)
- Elektronische, optische und magnetische Materialien
- Physik und Astronomie (insg.)
- Physik der kondensierten Materie
- Ingenieurwesen (insg.)
- Maschinenbau
- Ingenieurwesen (insg.)
- Elektrotechnik und Elektronik
Zitieren
- Standard
- Harvard
- Apa
- Vancouver
- BibTex
- RIS
17th IEEE International Conference on Micro Electro Mechanical Systems (MEMS): Maastricht MEMS 2004 Technical Digest. 2004. S. 462-465.
Publikation: Beitrag in Buch/Bericht/Sammelwerk/Konferenzband › Aufsatz in Konferenzband › Forschung › Peer-Review
}
TY - GEN
T1 - A planar micropump utilizing thermopneumatic actuation and in-plane flap valves
AU - Zimmermann, S.
AU - Frank, J. A.
AU - Liepmann, D.
AU - Pisano, A. P.
N1 - Conference code: 17
PY - 2004/9/27
Y1 - 2004/9/27
N2 - The micropump presented in this paper demonstrates advancements made both in performance and fabrication over most existing mechanical micropumps. The pump is planar and fabricated using a wafer-level, four-mask process, making it attractive for integration into micro total-analysis systems. Its design utilizes thermopneumatic actuation and two in-plane flap valves with fluidic-resistance ratios greater than 1300 to reach maximum pressures of 16 kPa and maximum flow rates of 9 μL/min at an average power consumption of 180 mW (20% duty cycle, 10 Hz). Pressures as high as 20.2 kPa were achieved at an average power consumption of 200 mW (20% duty cycle, 5 Hz). This performance is better than most micropumps utilizing in-plane or out-of-plane valves.
AB - The micropump presented in this paper demonstrates advancements made both in performance and fabrication over most existing mechanical micropumps. The pump is planar and fabricated using a wafer-level, four-mask process, making it attractive for integration into micro total-analysis systems. Its design utilizes thermopneumatic actuation and two in-plane flap valves with fluidic-resistance ratios greater than 1300 to reach maximum pressures of 16 kPa and maximum flow rates of 9 μL/min at an average power consumption of 180 mW (20% duty cycle, 10 Hz). Pressures as high as 20.2 kPa were achieved at an average power consumption of 200 mW (20% duty cycle, 5 Hz). This performance is better than most micropumps utilizing in-plane or out-of-plane valves.
UR - http://www.scopus.com/inward/record.url?scp=3042742397&partnerID=8YFLogxK
U2 - 10.1109/MEMS.2004.1290622
DO - 10.1109/MEMS.2004.1290622
M3 - Conference contribution
AN - SCOPUS:3042742397
SN - 078038265X
SP - 462
EP - 465
BT - 17th IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
T2 - 17th IEEE International Conference on Micro Electro Mechanical Systems
Y2 - 25 January 2004 through 29 January 2004
ER -