A new placement algorithm for an interconnect centric design flow

Publikation: Beitrag in Buch/Bericht/Sammelwerk/KonferenzbandAufsatz in KonferenzbandForschungPeer-Review

Autoren

  • C. Malonnek
  • M. Olbrich
  • E. Barke

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Details

OriginalspracheEnglisch
Titel des SammelwerksProceedings - 15th Annual IEEE International ASIC/SOC Conference, ASIC/SOC 2002
Herausgeber/-innenJohn Chickanosky, Ram K. Krishnamurthy, P.R. Mukund
Herausgeber (Verlag)Institute of Electrical and Electronics Engineers Inc.
Seiten416-420
Seitenumfang5
ISBN (elektronisch)0780374940
PublikationsstatusVeröffentlicht - 2002
Veranstaltung15th Annual IEEE International ASIC/SOC Conference, ASIC/SOC 2002 - Rochester, USA / Vereinigte Staaten
Dauer: 25 Sept. 200228 Sept. 2002

Publikationsreihe

NameProceedings of the Annual IEEE International ASIC Conference and Exhibit
Band2002-January
ISSN (Print)1063-0988

Abstract

We propose a new force-directed placement method for a cell based interconnect centric design flow. While the standard implementation of force-directed placement uses one attracting and one repelling force, we add a third force to each cell. This additional force represents the timing constraints of the design. For each path a cell belongs to, a force is applied to this cell to influence the length of the path. These forces depend on the timing constraints of the paths and are calculated together with the repelling forces. The force applied to every cell can be attracting, if the path constraint is not fulfilled or repelling, if the constraint is surpassed. First experimental results show that in comparison with a standard implementation of a force-directed placer the path length of critical paths is shorter.

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A new placement algorithm for an interconnect centric design flow. / Malonnek, C.; Olbrich, M.; Barke, E.
Proceedings - 15th Annual IEEE International ASIC/SOC Conference, ASIC/SOC 2002. Hrsg. / John Chickanosky; Ram K. Krishnamurthy; P.R. Mukund. Institute of Electrical and Electronics Engineers Inc., 2002. S. 416-420 1158095 (Proceedings of the Annual IEEE International ASIC Conference and Exhibit; Band 2002-January).

Publikation: Beitrag in Buch/Bericht/Sammelwerk/KonferenzbandAufsatz in KonferenzbandForschungPeer-Review

Malonnek, C, Olbrich, M & Barke, E 2002, A new placement algorithm for an interconnect centric design flow. in J Chickanosky, RK Krishnamurthy & PR Mukund (Hrsg.), Proceedings - 15th Annual IEEE International ASIC/SOC Conference, ASIC/SOC 2002., 1158095, Proceedings of the Annual IEEE International ASIC Conference and Exhibit, Bd. 2002-January, Institute of Electrical and Electronics Engineers Inc., S. 416-420, 15th Annual IEEE International ASIC/SOC Conference, ASIC/SOC 2002, Rochester, USA / Vereinigte Staaten, 25 Sept. 2002. https://doi.org/10.1109/ASIC.2002.1158095
Malonnek, C., Olbrich, M., & Barke, E. (2002). A new placement algorithm for an interconnect centric design flow. In J. Chickanosky, R. K. Krishnamurthy, & P. R. Mukund (Hrsg.), Proceedings - 15th Annual IEEE International ASIC/SOC Conference, ASIC/SOC 2002 (S. 416-420). Artikel 1158095 (Proceedings of the Annual IEEE International ASIC Conference and Exhibit; Band 2002-January). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ASIC.2002.1158095
Malonnek C, Olbrich M, Barke E. A new placement algorithm for an interconnect centric design flow. in Chickanosky J, Krishnamurthy RK, Mukund PR, Hrsg., Proceedings - 15th Annual IEEE International ASIC/SOC Conference, ASIC/SOC 2002. Institute of Electrical and Electronics Engineers Inc. 2002. S. 416-420. 1158095. (Proceedings of the Annual IEEE International ASIC Conference and Exhibit). doi: 10.1109/ASIC.2002.1158095
Malonnek, C. ; Olbrich, M. ; Barke, E. / A new placement algorithm for an interconnect centric design flow. Proceedings - 15th Annual IEEE International ASIC/SOC Conference, ASIC/SOC 2002. Hrsg. / John Chickanosky ; Ram K. Krishnamurthy ; P.R. Mukund. Institute of Electrical and Electronics Engineers Inc., 2002. S. 416-420 (Proceedings of the Annual IEEE International ASIC Conference and Exhibit).
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