Details
| Originalsprache | Englisch |
|---|---|
| Seiten (von - bis) | 2447-2451 |
| Seitenumfang | 5 |
| Fachzeitschrift | Microelectronics reliability |
| Jahrgang | 52 |
| Ausgabenummer | 9-10 |
| Publikationsstatus | Veröffentlicht - Sept. 2012 |
Abstract
By this article an introduction of a highly robust metal track layout especially suitable for high current and temperature applications will be introduced. Starting with the reliability limitations normally observed for wide metal tracks, conclusions regarding the requirements for robust layout techniques will be drawn. An optimized structure will be presented as well as the very promising results of first reliability investigations. It will be demonstrated that and how the optimized design is reducing the occurrence of degradation and instability effects.
ASJC Scopus Sachgebiete
- Werkstoffwissenschaften (insg.)
- Elektronische, optische und magnetische Materialien
- Physik und Astronomie (insg.)
- Atom- und Molekularphysik sowie Optik
- Ingenieurwesen (insg.)
- Sicherheit, Risiko, Zuverlässigkeit und Qualität
- Physik und Astronomie (insg.)
- Physik der kondensierten Materie
- Werkstoffwissenschaften (insg.)
- Oberflächen, Beschichtungen und Folien
- Ingenieurwesen (insg.)
- Elektrotechnik und Elektronik
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in: Microelectronics reliability, Jahrgang 52, Nr. 9-10, 09.2012, S. 2447-2451.
Publikation: Beitrag in Fachzeitschrift › Artikel › Forschung › Peer-Review
}
TY - JOUR
T1 - A design for robust wide metal tracks
AU - Ackermann, M.
AU - Hein, V.
AU - Kovács, C.
AU - Weide-Zaage, K.
N1 - Copyright: Copyright 2012 Elsevier B.V., All rights reserved.
PY - 2012/9
Y1 - 2012/9
N2 - By this article an introduction of a highly robust metal track layout especially suitable for high current and temperature applications will be introduced. Starting with the reliability limitations normally observed for wide metal tracks, conclusions regarding the requirements for robust layout techniques will be drawn. An optimized structure will be presented as well as the very promising results of first reliability investigations. It will be demonstrated that and how the optimized design is reducing the occurrence of degradation and instability effects.
AB - By this article an introduction of a highly robust metal track layout especially suitable for high current and temperature applications will be introduced. Starting with the reliability limitations normally observed for wide metal tracks, conclusions regarding the requirements for robust layout techniques will be drawn. An optimized structure will be presented as well as the very promising results of first reliability investigations. It will be demonstrated that and how the optimized design is reducing the occurrence of degradation and instability effects.
UR - http://www.scopus.com/inward/record.url?scp=84866733124&partnerID=8YFLogxK
U2 - 10.1016/j.microrel.2012.07.012
DO - 10.1016/j.microrel.2012.07.012
M3 - Article
AN - SCOPUS:84866733124
VL - 52
SP - 2447
EP - 2451
JO - Microelectronics reliability
JF - Microelectronics reliability
SN - 0026-2714
IS - 9-10
ER -