Details
| Originalsprache | Englisch |
|---|---|
| Aufsatznummer | 2300264 |
| Fachzeitschrift | Macromolecular Materials and Engineering |
| Jahrgang | 309 |
| Ausgabenummer | 2 |
| Publikationsstatus | Veröffentlicht - 15 Feb. 2024 |
Abstract
Conventional substrates for optoelectronic systems include inorganic or organic carrier materials; however, these systems are typically subjected to environmentally harmful multistep processes to prepare printed circuit boards. To mitigate these issues, the present article reports a polyether ether ketone (PEEK)-based composite densely filled with copper microparticles, prepared using a simple, cost-effective, and sustainable synthesis method. The material exhibits high thermal conductivity but is electrically nonconductive prior to undergoing laser treatment. To prevent the composite from exhibiting electrical conductivity, the copper particles are coated with a thin silica layer through a sol–gel reaction. The thermal stability of PEEK and the Cu–PEEK composites with Cu contents of up to 70 vol%, which are prepared via heat melding, is investigated by thermogravimetric analysis, differential scanning calorimetry, and Fourier-transform infrared spectroscopy to clarify the manner in which copper affects the chemical structure of the polymer. The developed composite exhibits a significantly higher thermal conductivity than that of the unfilled PEEK polymer. This paper also describes the effects of laser treatment on the surface morphology. Overall, this study suggests that conductive tracks with low electrical resistance can be created on electrically insulating substrates with high thermal conductivity.
ASJC Scopus Sachgebiete
- Chemische Verfahrenstechnik (insg.)
- Allgemeine chemische Verfahrenstechnik
- Werkstoffwissenschaften (insg.)
- Polymere und Kunststoffe
- Chemie (insg.)
- Organische Chemie
- Werkstoffwissenschaften (insg.)
- Werkstoffchemie
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in: Macromolecular Materials and Engineering, Jahrgang 309, Nr. 2, 2300264, 15.02.2024.
Publikation: Beitrag in Fachzeitschrift › Artikel › Forschung › Peer-Review
}
TY - JOUR
T1 - A Composite of Polyether Ether Ketone and Silica-Coated Copper Particles for Creating Tailored Conductive Tracks via Laser Printing
AU - Schnettger, Alexander
AU - Holländer, Ulrich
AU - Maier, Hans J.
N1 - Funding information: This study was funded by the Deutsche Forschungsgemeinde under Germany's Excellence Strategy program at the Cluster of Excellence PhoenixD (Leibniz Universität Hannover; EXC 2122, Project ID 390833453).
PY - 2024/2/15
Y1 - 2024/2/15
N2 - Conventional substrates for optoelectronic systems include inorganic or organic carrier materials; however, these systems are typically subjected to environmentally harmful multistep processes to prepare printed circuit boards. To mitigate these issues, the present article reports a polyether ether ketone (PEEK)-based composite densely filled with copper microparticles, prepared using a simple, cost-effective, and sustainable synthesis method. The material exhibits high thermal conductivity but is electrically nonconductive prior to undergoing laser treatment. To prevent the composite from exhibiting electrical conductivity, the copper particles are coated with a thin silica layer through a sol–gel reaction. The thermal stability of PEEK and the Cu–PEEK composites with Cu contents of up to 70 vol%, which are prepared via heat melding, is investigated by thermogravimetric analysis, differential scanning calorimetry, and Fourier-transform infrared spectroscopy to clarify the manner in which copper affects the chemical structure of the polymer. The developed composite exhibits a significantly higher thermal conductivity than that of the unfilled PEEK polymer. This paper also describes the effects of laser treatment on the surface morphology. Overall, this study suggests that conductive tracks with low electrical resistance can be created on electrically insulating substrates with high thermal conductivity.
AB - Conventional substrates for optoelectronic systems include inorganic or organic carrier materials; however, these systems are typically subjected to environmentally harmful multistep processes to prepare printed circuit boards. To mitigate these issues, the present article reports a polyether ether ketone (PEEK)-based composite densely filled with copper microparticles, prepared using a simple, cost-effective, and sustainable synthesis method. The material exhibits high thermal conductivity but is electrically nonconductive prior to undergoing laser treatment. To prevent the composite from exhibiting electrical conductivity, the copper particles are coated with a thin silica layer through a sol–gel reaction. The thermal stability of PEEK and the Cu–PEEK composites with Cu contents of up to 70 vol%, which are prepared via heat melding, is investigated by thermogravimetric analysis, differential scanning calorimetry, and Fourier-transform infrared spectroscopy to clarify the manner in which copper affects the chemical structure of the polymer. The developed composite exhibits a significantly higher thermal conductivity than that of the unfilled PEEK polymer. This paper also describes the effects of laser treatment on the surface morphology. Overall, this study suggests that conductive tracks with low electrical resistance can be created on electrically insulating substrates with high thermal conductivity.
KW - copper
KW - laser direct structuring
KW - polyether ether ketone
KW - sol–gel
KW - thermal conductivity
UR - http://www.scopus.com/inward/record.url?scp=85174949405&partnerID=8YFLogxK
U2 - 10.1002/mame.202300264
DO - 10.1002/mame.202300264
M3 - Article
AN - SCOPUS:85174949405
VL - 309
JO - Macromolecular Materials and Engineering
JF - Macromolecular Materials and Engineering
SN - 1438-7492
IS - 2
M1 - 2300264
ER -