Details
| Originalsprache | Englisch |
|---|---|
| Titel des Sammelwerks | Annual Proceedings - Reliability Physics (Symposium) |
| Seiten | 361-365 |
| Seitenumfang | 5 |
| Publikationsstatus | Veröffentlicht - 1992 |
| Veranstaltung | 30th Annual International Reliability Physics Symposium - San Diego, CA, USA Dauer: 31 März 1992 → 2 Apr. 1992 |
Publikationsreihe
| Name | Annual Proceedings - Reliability Physics (Symposium) |
|---|---|
| ISSN (Print) | 0099-9512 |
Abstract
The influence of geometry (overlap, step coverage, filling ratio) and filling material on temperature and current density distributions in via structures of different forms and technologies simulated with the finite element method program ANSYS was studied. Vias of square, circular, and oval forms were investigated. The influence of via filling was observed. Reduction of current crowding and self-heating effects were found for the tungsten-filled via. Critical parameters for the filling materials were determined. Local temperature and current density distributions are shown.
ASJC Scopus Sachgebiete
- Ingenieurwesen (insg.)
- Elektrotechnik und Elektronik
- Ingenieurwesen (insg.)
- Sicherheit, Risiko, Zuverlässigkeit und Qualität
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Annual Proceedings - Reliability Physics (Symposium). 1992. S. 361-365 (Annual Proceedings - Reliability Physics (Symposium)).
Publikation: Beitrag in Buch/Bericht/Sammelwerk/Konferenzband › Aufsatz in Konferenzband › Forschung › Peer-Review
}
TY - GEN
T1 - 3-dimensional simulations of temperature and current density distribution in a via structure
AU - Weide, K.
AU - Hasse, W.
N1 - Copyright: Copyright 2020 Elsevier B.V., All rights reserved.
PY - 1992
Y1 - 1992
N2 - The influence of geometry (overlap, step coverage, filling ratio) and filling material on temperature and current density distributions in via structures of different forms and technologies simulated with the finite element method program ANSYS was studied. Vias of square, circular, and oval forms were investigated. The influence of via filling was observed. Reduction of current crowding and self-heating effects were found for the tungsten-filled via. Critical parameters for the filling materials were determined. Local temperature and current density distributions are shown.
AB - The influence of geometry (overlap, step coverage, filling ratio) and filling material on temperature and current density distributions in via structures of different forms and technologies simulated with the finite element method program ANSYS was studied. Vias of square, circular, and oval forms were investigated. The influence of via filling was observed. Reduction of current crowding and self-heating effects were found for the tungsten-filled via. Critical parameters for the filling materials were determined. Local temperature and current density distributions are shown.
UR - http://www.scopus.com/inward/record.url?scp=0026836905&partnerID=8YFLogxK
U2 - 10.1109/relphy.1992.187670
DO - 10.1109/relphy.1992.187670
M3 - Conference contribution
AN - SCOPUS:0026836905
SN - 078030473X
SN - 9780780304734
T3 - Annual Proceedings - Reliability Physics (Symposium)
SP - 361
EP - 365
BT - Annual Proceedings - Reliability Physics (Symposium)
T2 - 30th Annual International Reliability Physics Symposium
Y2 - 31 March 1992 through 2 April 1992
ER -