Details
| Originalsprache | Englisch |
|---|---|
| Titel des Sammelwerks | 2023 15th International Congress Mechatronic Integration Discourse, MID 2023 |
| Herausgeber (Verlag) | Institute of Electrical and Electronics Engineers Inc. |
| ISBN (elektronisch) | 9798350374735 |
| Publikationsstatus | Veröffentlicht - 2023 |
| Veranstaltung | 15th International Congress Mechatronic Integration Discourse, MID 2023 - Amberg, Deutschland Dauer: 21 Juni 2023 → 22 Juni 2023 |
Publikationsreihe
| Name | 2023 15th International Congress Mechatronic Integration Discourse, MID 2023 |
|---|
Abstract
This paper presents a novel 3D multilayer device technology classification to compare existing approaches in the field and the first demonstrators fabricated using the multilayer printing approach. The circuit and application designs demonstrated, together with the manufacturing analysis and discussion, provide a basis for further development in this area. The demonstrators showcased cover a range of applications, including double-layer resonant circuits, multidirectional lighting devices with a high density of light-emitting diodes, microcontroller circuits, and five-layer area arrays with 100 densely arranged contact pads. Assembly processes of electric components are possible by using conductive adhesives for temperature-sensitive polymer samples and low-temperature solder paste for temperature-resistant samples. The process compatibility with additive-manufactured components from a 3D printer offers a high level of adaptability for future applications. The main practical focus of this paper is on the layout generation and dimensioning of the spatial printed circuit layout while taking maximum currents into account and ensuring the highest possible long-term stability. Laboratory test productions provide an initial proof of concept.
ASJC Scopus Sachgebiete
- Ingenieurwesen (insg.)
- Elektrotechnik und Elektronik
- Ingenieurwesen (insg.)
- Wirtschaftsingenieurwesen und Fertigungstechnik
- Werkstoffwissenschaften (insg.)
- Elektronische, optische und magnetische Materialien
- Physik und Astronomie (insg.)
- Instrumentierung
Zitieren
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- BibTex
- RIS
2023 15th International Congress Mechatronic Integration Discourse, MID 2023. Institute of Electrical and Electronics Engineers Inc., 2023. (2023 15th International Congress Mechatronic Integration Discourse, MID 2023).
Publikation: Beitrag in Buch/Bericht/Sammelwerk/Konferenzband › Aufsatz in Konferenzband › Forschung › Peer-Review
}
TY - GEN
T1 - 3D Multilayer Printing of 3D Multilayer Devices
AU - Olsen, Ejvind
AU - Pflieger, Keno
AU - Evertz, Andreas
AU - Futterer, Laura
AU - Overmeyer, Ludger
N1 - Publisher Copyright: © 2023 IEEE.
PY - 2023
Y1 - 2023
N2 - This paper presents a novel 3D multilayer device technology classification to compare existing approaches in the field and the first demonstrators fabricated using the multilayer printing approach. The circuit and application designs demonstrated, together with the manufacturing analysis and discussion, provide a basis for further development in this area. The demonstrators showcased cover a range of applications, including double-layer resonant circuits, multidirectional lighting devices with a high density of light-emitting diodes, microcontroller circuits, and five-layer area arrays with 100 densely arranged contact pads. Assembly processes of electric components are possible by using conductive adhesives for temperature-sensitive polymer samples and low-temperature solder paste for temperature-resistant samples. The process compatibility with additive-manufactured components from a 3D printer offers a high level of adaptability for future applications. The main practical focus of this paper is on the layout generation and dimensioning of the spatial printed circuit layout while taking maximum currents into account and ensuring the highest possible long-term stability. Laboratory test productions provide an initial proof of concept.
AB - This paper presents a novel 3D multilayer device technology classification to compare existing approaches in the field and the first demonstrators fabricated using the multilayer printing approach. The circuit and application designs demonstrated, together with the manufacturing analysis and discussion, provide a basis for further development in this area. The demonstrators showcased cover a range of applications, including double-layer resonant circuits, multidirectional lighting devices with a high density of light-emitting diodes, microcontroller circuits, and five-layer area arrays with 100 densely arranged contact pads. Assembly processes of electric components are possible by using conductive adhesives for temperature-sensitive polymer samples and low-temperature solder paste for temperature-resistant samples. The process compatibility with additive-manufactured components from a 3D printer offers a high level of adaptability for future applications. The main practical focus of this paper is on the layout generation and dimensioning of the spatial printed circuit layout while taking maximum currents into account and ensuring the highest possible long-term stability. Laboratory test productions provide an initial proof of concept.
KW - 3D structural electronics
KW - copper ink coating
KW - insulator printing
KW - laser material processing
KW - multilayer MID
UR - http://www.scopus.com/inward/record.url?scp=85187781752&partnerID=8YFLogxK
U2 - 10.1109/MID59615.2023.10461321
DO - 10.1109/MID59615.2023.10461321
M3 - Conference contribution
AN - SCOPUS:85187781752
T3 - 2023 15th International Congress Mechatronic Integration Discourse, MID 2023
BT - 2023 15th International Congress Mechatronic Integration Discourse, MID 2023
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 15th International Congress Mechatronic Integration Discourse, MID 2023
Y2 - 21 June 2023 through 22 June 2023
ER -