KAVUAKA: A Low Power Application Specific Hearing Aid Processor

Gerlach, L., Paya-Vaya, G. & Blume, H., Okt. 2019, 2019 IFIP/IEEE 27th International Conference on Very Large Scale Integration (VLSI-SoC): Proceedings. Metzler, C., De Micheli, G., Gaillardon, P.-E., Silva-Cardenas, C. & Reis, R. (Hrsg.). Institute of Electrical and Electronics Engineers Inc., S. 99-104 6 S. 8920354. (International Conference on VLSI and System-on-Chip).

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Deep Learning Based Classification of Pedestrian Vulnerability Trained on Synthetic Datasets

Schleusner, J., Neu, L., Behmann, N. & Blume, H., 8 Sept. 2019, 2019 IEEE 9th International Conference on Consumer Electronics (ICCE-Berlin): Proceedings. Velikic, G. & Gross, C. (Hrsg.). Institute of Electrical and Electronics Engineers Inc., S. 353-356 4 S.

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Statistical Performance Prediction for Multicore Applications Based on Scalability Characteristics

Arndt, O. J., Luders, M. & Blume, H., 5 Sept. 2019, 2019 IEEE 30th International Conference on Application-Specific Systems, Architectures and Processors (ASAP): Proceedings. IEEE Computer Society, S. 255-262 8 S. (Proceedings of the International Conference on Application-Specific Systems, Architectures and Processors).

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Design and optimization of an ARM cortex-M based SoC for TCP/IP communication in high temperature applications

Stuckenberg, T., Gottschlich, M., Nolting, S. & Blume, H., 8 Aug. 2019, Embedded Computer Systems: Architectures, Modeling, and Simulation - 19th International Conference, SAMOS 2019, Proceedings. Pnevmatikatos, D. N., Pelcat, M. & Jung, M. (Hrsg.). Cham: Springer Verlag, S. 169-183 15 S. (Lecture Notes in Computer Science (including subseries Lecture Notes in Artificial Intelligence and Lecture Notes in Bioinformatics); Band 11733 LNCS).

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Evaluation of Different Processor Architecture Organizations for On-site Electronics in Harsh Environments

Gesper, S. T., Weißbrich, M., Nolting, S., Stuckenberg, T., Jääskeläinen, P., Blume, H. & Payá-Vayá, G., 8 Aug. 2019, Embedded Computer Systems: Architectures, Modeling, and Simulation - 19th International Conference, SAMOS 2019, Proceedings. Pnevmatikatos, D. N., Pelcat, M. & Jung, M. (Hrsg.). Cham, S. 3-17 15 S. (Lecture Notes in Computer Science (including subseries Lecture Notes in Artificial Intelligence and Lecture Notes in Bioinformatics); Band 11733 LNCS)( Theoretical Computer Science and General Issues; Band 11733 LNTCS ).

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Portable implementationsfor heterogeneous hardwareplatforms in autonomousdriving systems

Arndt, O. J., Rallapalli, P. & Blume, H. C., 19 Juli 2019, Big Data Analytics for Cyber-Physical Systems: Machine Learning for the Internet of Things. Dartmann, G., Song, H. & Schmeink, A. (Hrsg.). Elsevier, S. 113-143 31 S.

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A Coding Approach to Improve the Energy Efficiency of Approximate NoCs

Najafi, A., Bamberg, L., Payá Vayá, G. & Ortiz, A. G., Juli 2019, 14th International Symposium on Reconfigurable Communication-centric Systems-on-Chip (ReCoSoC 2019): Proceedings. Fornaciari, W., Novo, D. & Indrusiak, L. S. (Hrsg.). Institute of Electrical and Electronics Engineers Inc., S. 74-81 8 S. 9034965. (International Symposium on Reconfigurable and Communication-Centric Systems-on-Chip (ReCoSoC)).

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Enabling Complex Stimuli in Accelerated Mixed-Signal Simulation

Divanbeigi, S., Aditya, E., Wang, Z. & Olbrich, M., 2 Juni 2019, Proceedings of the 56th Annual Design Automation Conference 2019. S. 69 a69. (Proceedings - Design Automation Conference).

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New-Automotive -Autonomous Driving Challenges For The Microelectronic Components

Weide-Zaage, K., 22 Apr. 2019, 2019 Pan Pacific Microelectronics Symposium, Pan Pacific 2019: Proceedings. Institute of Electrical and Electronics Engineers Inc., 6 S. 8696273

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A 30 ns 16 Mb 2 b/cell Embedded Flash with Ramped Gate Time-Domain Sensing Scheme for Automotive Application

Kiesel, S., Kern, T., Wicht, B. & Graeb, H., Apr. 2019, 2019 International Symposium on VLSI Design, Automation and Test (VLSI-DAT). S. 1-4 8741536

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A Fully Integrated 85%-Peak-Efficiency Hybrid Multi Ratio Resonant DC-DC Converter with 3.0-to-4.5V Input and 500μA -to-120mA Load Range

Renz, P., Kaufmann, M., Lueders, M. & Wicht, B., 6 März 2019, 2019 IEEE International Solid-State Circuits Conference, ISSCC 2019. S. 156-158 3 S. 8662491. (Digest of Technical Papers - IEEE International Solid-State Circuits Conference; Band 2019-February).

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Electromigration effects in corroded BGA

Weide-Zaage, K., Guedon-Gracia, A. & Fremont, H., März 2019, 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2019: Proceedings. Institute of Electrical and Electronics Engineers Inc., 8724522

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Layout optimization of CMOS interconnects for heating, cooling and improved stress distribution

Hein, V., Weide-Zaage, K. & Yang, X., März 2019, 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2019: Proceedings. Institute of Electrical and Electronics Engineers Inc., 8724562

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Simulations in terms of radiation effects on different BEOL material systems

Weide-Zaage, K., Paya-Vaya, G. & Eichin, P., März 2019, 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2019: Proceedings. Institute of Electrical and Electronics Engineers Inc., 8724581

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