Design Space Exploration of Semantic Segmentation CNN SalsaNext for Constrained Architectures

Renke, O., Riggers, C., Karrenbauer, J. & Blume, H., 2024, Proceedings - 2024 IEEE 35th International Conference on Application-Specific Systems, Architectures and Processors, ASAP 2024. S. 28-29 2 S. (IEEE International Conference on Application-Specific Systems, Architectures, and Processors).

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Dna Digital-storage: Advantages, Approach and Technical Implementation

Weide-Zaage, K., 2024, 2024 Pan Pacific Strategic Electronics Symposium: Pan Pacific. Institute of Electrical and Electronics Engineers Inc., 6 S.

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Enhancing a Hearing Aid Processor with ISA Extensions Supporting Flexible Fixed-Point Formats

Karrenbauer, J., Schönewald, S., Klein, S. & Blume, H., 2024, Proceedings - 2024 IEEE 35th International Conference on Application-Specific Systems, Architectures and Processors, ASAP 2024. S. 176-183 8 S. (EEE International Conference on Application-Specific Systems, Architectures, and Processors).

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Enhancing RISC-V Processor Performance in Harsh Environments through Data Cache Optimization

Frühauf, J., Hawich, M. & Blume, H. C., 2024, 2024 Panhellenic Conference on Electronics & Telecommunications (PACET). S. 1-4 4 S. (Panhellenic Conference on Electronics & Telecommunications (PACET)).

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Improving Clock Frequencies in ASIC Designs through Semi-Automatic Register Placement and Advanced Retiming

Hawich, M., Klein, S. C., Stuckenberg, T. & Blume, H. C., 2024, 2024 Panhellenic Conference on Electronics & Telecommunications (PACET). S. 1-6 6 S. (Panhellenic Conference on Electronics & Telecommunications (PACET)).

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Learning of Multimodal Point Descriptors in Radar and LIDAR Point Clouds

Rotter, J. M., Cohrs, S., Blume, H. & Wagner, B., 2024, 2024 IEEE International Conference on Multisensor Fusion and Integration for Intelligent Systems (MFI). (IEEE International Conference on Multisensor Fusion and Integration for Intelligent Systems).

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Multi-Level Prototyping of a Vertical Vector AI Processing System

Kautz, F., Gesper, S., Thieu, G. B., Bluethgen, H. M., Blume, H. & Paya-Vaya, G., 2024, Proceedings - 2024 IEEE 35th International Conference on Application-Specific Systems, Architectures and Processors, ASAP 2024. Institute of Electrical and Electronics Engineers Inc., S. 1-2 2 S. (Proceedings of the International Conference on Application-Specific Systems, Architectures and Processors).

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Non-linear Filtering Techniques for Improving Accurate Vehicle Angle Determination

Pfleiderer, R., Ramsdorf, J., Boländer, Y. & Blume, H., 2024, 2024 Kleinheubach Conference.

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Optimizing RISC-V Processor Performance with Adaptive Execution Unit Lengths in Harsh Environment Conditio

Szücs, J., Hawich, M. & Blume, H. C., 2024, 2024 Panhellenic Conference on Electronics & Telecommunications (PACET). S. 1-5 5 S.

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Overshoot Prevention in Monolithic GaN by Ultra-Low ESL Gate Loop Design Using Chip-Scale Capacitors and Gate Driver Pull-Up Path Tuning Technique

Deneke, N. & Wicht, B., 2024, 2024 IEEE Applied Power Electronics Conference and Exposition: APEC . Institute of Electrical and Electronics Engineers Inc., S. 2409-2414 6 S.

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PTP-Synchronized Tri-Level Sync Generation for Networked Multi-Sensor Systems

Riggers, C., Schleusner, J., Renke, O. & Blume, H., 2024, 2024 IEEE 30th International Conference on Embedded and Real-Time Computing Systems and Applications (RTCSA). S. 91-96 6 S.

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Simulation of Different SRAM Cells under Neutron Radiation with GEANT4

Weide-Zaage, K., Mandala, S. J., Trumann, E., Paya-Vaya, G., Wolff, D. V., Bausen, A. & Muller, A., 2024, 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems: EuroSimE . Institute of Electrical and Electronics Engineers Inc., 4 S.

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Single Snapshot Array Interpolation for Angular Estimation in Automotive Radar Applications

Jauch, A., Meinl, F. & Blume, H., 2024, 2024 15th German Microwave Conference, GeMiC 2024. Institute of Electrical and Electronics Engineers Inc., S. 257-260 4 S.

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Technical Implementation of DNA Data-Storage

Weide-Zaage, K., 2024, 2024 International Conference on Electronics Packaging (ICEP). Institute of Electrical and Electronics Engineers Inc., S. 111-112 2 S.

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The Comparison of the Reliability Performance of Different Top Metal Materials in MEMS Applications

Hein, V., Weide-Zaage, K. & Clausner, A., 2024, 2024 Pan Pacific Strategic Electronics Symposium: Pan Pacific. Institute of Electrical and Electronics Engineers Inc., 6 S.

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Synthetic Aperture Radar Algorithms on Transport Triggered Architecture Processors using OpenCL

Rother, N., Mätzner, L., Jääskeläinen, P., Leppänen, T., Schleusner, J. K. & Blume, H. C., 28 Dez. 2023, Proceedings of the International Radar Conference 2023. (Proceedings of the IEEE Radar Conference).

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ZuSE-KI-mobil: Platform for Energy Efficient AI-Processors in Mobile Applications

Vögel, H. J., Becker, J., Benndorf, J., Bierzynski, K., Blume, H., Fettweis, G., Friedrich, M., Friedrich, S., Grantz, D., Höfer, J., Kempf, F., Lüders, M. & Teepe, G., Dez. 2023, MikroSystemTechnik Kongress 2023 - Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Nachhaltigkeit und Technologiesouveranitat, Proceedings. VDE Verlag GmbH, S. 889-894 6 S.

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